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Wire Bonding pcb ENEPIG surface finished high quality PCB production

Wire Bonding pcb ENEPIG surface finished high quality PCB production
  • Wire Bonding pcb ENEPIG surface finished high quality PCB production
  • Wire Bonding pcb ENEPIG surface finished high quality PCB production

Wire Bonding pcb ENEPIG surface finished high quality PCB production

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Enterprise Strength
  • Rocket PCB has a unique quality management system for production management. At the same time, our large after-sales service team can improve the quality of the products by investigating the opinions and feedback of customers.
Product Details
Rocket PCB pursues excellent quality and strives for perfection in every detail during the production.Rocket PCB is certified by various qualifications. We have advanced production technology and great production capability. printed circuit board has many advantages such as reasonable structure, excellent performance, good quality, and affordable price.
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Company Advantages
1. By adopting the lean production method, Rocket PCB ic wire bonding is exquisite in detail.
2. The product is tested at various stages of development.
3. The popularity of this product among customers is increasing and has no sign of slow down.

methods


Wire Bonding pcb ENEPIG surface finished high quality PCB production-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


Wire Bonding pcb ENEPIG surface finished high quality PCB production-2                
Consumer electronics
Wire Bonding pcb ENEPIG surface finished high quality PCB production-3                
Automotive electronics
Wire Bonding pcb ENEPIG surface finished high quality PCB production-4                
Communications
Wire Bonding pcb ENEPIG surface finished high quality PCB production-5                
Energy
Wire Bonding pcb ENEPIG surface finished high quality PCB production-6                
Industrial & Instrumentation
Wire Bonding pcb ENEPIG surface finished high quality PCB production-7                
IOT/Smart Home
Wire Bonding pcb ENEPIG surface finished high quality PCB production-8                
Medical electronics
Wire Bonding pcb ENEPIG surface finished high quality PCB production-9                
Security Industry

Company Features
1. Rocket PCB wins world-wide reputation by its remarkable wire bonding pcb .
2. Rocket PCB takes the dominance of wire bonding technology market because of the high quality ic wire bonding and considerate simple pcb board.
3. Rocket PCB has been providing high quality service for customers. Check now! Our finest quality wire bonding and mature service will satisfy you. Check now! Rocket PCB has been consistently offering one-stop service for customers at home and abroad. Check now! More and more customers speak highly of the service of Rocket PCB. Check now!
The raw materials of Rocket PCB ic wire bonding is superior and thus it comes out with high quality. With the minor improvement in a connection point, the product is known as stylish, elegant and stable
From design to manufacturing, Rocket PCB wire bonding is provided with great attention to the details. The product is safe for those with nickel allergy as it contains no nickel
Backed by our rich industry experience and market understanding, Rocket PCB simple pcb board is endowed with an innovative and well-received design. It has the ability to tolerate greater tension than other suchlike
The materials of Rocket PCB wire bonding technology are of the highest quality as they have been strictly examined according to our high standard and set the industry standard. Its dimensions are within a tolerance of less than 0.03mm
Rocket PCB wire bonding pcb is designed by our experienced designers that are leaders in the industry. The product is not easy to rust thanks to the corrosion resistant coatings
The product is unaffected by temperature variations. Each batch of materials used to make this product is pre-tested to ensure that these materials own stable physical and chemical properties. Though it is lightweight, the product features long-term durability
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: hans.hu@rocket-pcb.com welcome to consult!