Rocket PCB  >  AI - Page Sitemap  >  Wire Bonding pcb ENEPIG surface finished high quality PCB production
Wire Bonding pcb ENEPIG surface finished high quality PCB production

Wire Bonding pcb ENEPIG surface finished high quality PCB production
  • Wire Bonding pcb ENEPIG surface finished high quality PCB production
  • Wire Bonding pcb ENEPIG surface finished high quality PCB production

Wire Bonding pcb ENEPIG surface finished high quality PCB production

methods
Inquire Online
Get the latest price
Quantity Needed:
Pieces
E-mail:
Enterprise Strength
  • Rocket PCB has a unique quality management system for production management. At the same time, our large after-sales service team can improve the quality of the products by investigating the opinions and feedback of customers.
Product Details
Rocket PCB pursues excellent quality and strives for perfection in every detail during the production.Rocket PCB is certified by various qualifications. We have advanced production technology and great production capability. printed circuit board has many advantages such as reasonable structure, excellent performance, good quality, and affordable price.
  • Wire Bonding pcb ENEPIG surface finished high quality PCB production-Rocket PCB-img
Company Advantages
1. By adopting the lean production method, Rocket PCB ic wire bonding is exquisite in detail.
2. The product is tested at various stages of development.
3. The popularity of this product among customers is increasing and has no sign of slow down.

methods


Wire Bonding pcb ENEPIG surface finished high quality PCB production-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


Wire Bonding pcb ENEPIG surface finished high quality PCB production-2                
Consumer electronics
Wire Bonding pcb ENEPIG surface finished high quality PCB production-3                
Automotive electronics
Wire Bonding pcb ENEPIG surface finished high quality PCB production-4                
Communications
Wire Bonding pcb ENEPIG surface finished high quality PCB production-5                
Energy
Wire Bonding pcb ENEPIG surface finished high quality PCB production-6                
Industrial & Instrumentation
Wire Bonding pcb ENEPIG surface finished high quality PCB production-7                
IOT/Smart Home
Wire Bonding pcb ENEPIG surface finished high quality PCB production-8                
Medical electronics
Wire Bonding pcb ENEPIG surface finished high quality PCB production-9                
Security Industry

Company Features
1. Rocket PCB wins world-wide reputation by its remarkable wire bonding pcb .
2. Rocket PCB takes the dominance of wire bonding technology market because of the high quality ic wire bonding and considerate simple pcb board.
3. Rocket PCB has been providing high quality service for customers. Check now! Our finest quality wire bonding and mature service will satisfy you. Check now! Rocket PCB has been consistently offering one-stop service for customers at home and abroad. Check now! More and more customers speak highly of the service of Rocket PCB. Check now!
Rocket PCB simple pcb board is developed under the combined principles of industrial design and modern scientific architecture. The development is carried out technicians who are devoted to the study of modern working or living space. It does not cause any corrosion to the material
Rocket PCB ic wire bonding is tailored by adopting several pieces of advanced and high-efficient production machines. These machines include pattern design computers, cutting machines, dyeing machines, sewing machines, and performance testing machines. It is resistant to high temperature and low-temperature alternation
The design of Rocket PCB simple pcb board focuses on the principles of biomechanics. It lays emphasis on arch support, assistant arch treatment, and various foot diseases. Water absorption and coefficient of linear expansion of this product are small
Rocket PCB wire bonding pcb has a practical design. This design works upon the mood board, theme board, colour palette, trends and the entire outline of the garment. Its curing exothermic peak is low and the curing shrinkage is small
Rocket PCB wire bonding has passed the tests required in the footwear industry. These tests include softness testing, wear resistance testing, thermal insulation testing, heat and fire protection testing. It features high thermal stability and excellent wear resistance
No bubbling or wrinkling occurs on its surface. During the preliminary treatment process, the cleaning and removing of rust and phosphating are carried out thoroughly to eliminate any sags and crests. It has excellent electrical insulation performance
Product Message
Chat Online 编辑模式下无法使用
Chat Online inputting...
Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: hans.hu@rocket-pcb.com welcome to consult!