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Wire Bonding pcb ENEPIG surface finished high quality PCB production

Wire Bonding pcb ENEPIG surface finished high quality PCB production
  • Wire Bonding pcb ENEPIG surface finished high quality PCB production
  • Wire Bonding pcb ENEPIG surface finished high quality PCB production

Wire Bonding pcb ENEPIG surface finished high quality PCB production

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Enterprise Strength
  • Rocket PCB has a unique quality management system for production management. At the same time, our large after-sales service team can improve the quality of the products by investigating the opinions and feedback of customers.
Product Details
Rocket PCB pursues excellent quality and strives for perfection in every detail during the production.Rocket PCB is certified by various qualifications. We have advanced production technology and great production capability. printed circuit board has many advantages such as reasonable structure, excellent performance, good quality, and affordable price.
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Company Advantages
1. By adopting the lean production method, Rocket PCB ic wire bonding is exquisite in detail.
2. The product is tested at various stages of development.
3. The popularity of this product among customers is increasing and has no sign of slow down.

methods


Wire Bonding pcb ENEPIG surface finished high quality PCB production-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


Wire Bonding pcb ENEPIG surface finished high quality PCB production-2                
Consumer electronics
Wire Bonding pcb ENEPIG surface finished high quality PCB production-3                
Automotive electronics
Wire Bonding pcb ENEPIG surface finished high quality PCB production-4                
Communications
Wire Bonding pcb ENEPIG surface finished high quality PCB production-5                
Energy
Wire Bonding pcb ENEPIG surface finished high quality PCB production-6                
Industrial & Instrumentation
Wire Bonding pcb ENEPIG surface finished high quality PCB production-7                
IOT/Smart Home
Wire Bonding pcb ENEPIG surface finished high quality PCB production-8                
Medical electronics
Wire Bonding pcb ENEPIG surface finished high quality PCB production-9                
Security Industry

Company Features
1. Rocket PCB wins world-wide reputation by its remarkable wire bonding pcb .
2. Rocket PCB takes the dominance of wire bonding technology market because of the high quality ic wire bonding and considerate simple pcb board.
3. Rocket PCB has been providing high quality service for customers. Check now! Our finest quality wire bonding and mature service will satisfy you. Check now! Rocket PCB has been consistently offering one-stop service for customers at home and abroad. Check now! More and more customers speak highly of the service of Rocket PCB. Check now!
Rocket PCB ic wire bonding from our company has excellent quality. Materials used for it are sourced from trustworthy suppliers and are of first-class. The product is sold to over 50 countries such as the USA and the UK
The manufactured of Rocket PCB wire bonding technology adopts various cutting-edge machines. They are high--speed precise CNC fabrication equipment and quality testing facilities such as height gauge and measuring instrument. It is mainly for advanced skilled vapers
All fibre materials of Rocket PCB ic wire bonding are approved by the QC team. These materials are carefully screened and tested to ensure that they comply with the safety regulations of the textile industry. It is marketed under our own brand namely Ambition Mods which will soon be a leader in this field
The following tests must be performed in Rocket PCB wire bonding production. These tests involve dielectric withstand inspection, insulation resistance inspection, leakage current inspection, and the like. Well trained engineers and workers are strong support to its manufacturing
Rocket PCB wire bonding technology has gone through strict inspections. These inspections involve the sections that can entrap fingers and other body parts; sharp edges and corners; shear and squeeze points; stability, structural strength, and durability. It can be delivered fast thanks to our location in Shenzhen which enjoys traffic convenience
This product yields best-in-class thermal performance. The fiber-reinforced materials used with innovative designs carry improved thermal performance of this product. It has been patented so as to protect the innovation
Product Message
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