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Wire Bonding pcb ENEPIG surface finished high quality PCB production

Wire Bonding pcb ENEPIG surface finished high quality PCB production
  • Wire Bonding pcb ENEPIG surface finished high quality PCB production
  • Wire Bonding pcb ENEPIG surface finished high quality PCB production

Wire Bonding pcb ENEPIG surface finished high quality PCB production

Rocket PCB Solution Ltd. integrates scientific research, manufacturing and distribution of wire bonding technology .
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Application Scope
HDI PCB developed by Rocket PCB is widely used, mainly in the following scenes.Rocket PCB is dedicated to providing professional, efficient and economical solutions for customers, so as to meet their needs to the greatest extent.
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Company Advantages
1. The series of wire bonding technology are semiconductor wire bonding , will bring the best result of [拓展关键词特点] for you.
2. The product features good flexibility. It adopts high-quality aluminum alloy material, which is not easy to break down in the face of certain external force such as strong wind.
3. It has good chemical stability. It is not prone to have a reaction with light, heat, acid, alkali, and organic solvents.
4. Due to its remarkable characteristics, the product is increasingly used in the market.
5. The product is favored by a large number of people, showing the broad market application prospect of the product.

methods


Wire Bonding pcb ENEPIG surface finished high quality PCB production-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


Wire Bonding pcb ENEPIG surface finished high quality PCB production-2                
Consumer electronics
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Automotive electronics
Wire Bonding pcb ENEPIG surface finished high quality PCB production-4                
Communications
Wire Bonding pcb ENEPIG surface finished high quality PCB production-5                
Energy
Wire Bonding pcb ENEPIG surface finished high quality PCB production-6                
Industrial & Instrumentation
Wire Bonding pcb ENEPIG surface finished high quality PCB production-7                
IOT/Smart Home
Wire Bonding pcb ENEPIG surface finished high quality PCB production-8                
Medical electronics
Wire Bonding pcb ENEPIG surface finished high quality PCB production-9                
Security Industry

Company Features
1. Rocket PCB Solution Ltd. integrates scientific research, manufacturing and distribution of wire bonding technology .
2. The factory has comprehensive one-stop production facilities. Those facilities are all certified under the specific quality system. This enables the factory to manufacture high quality and uniform products.
3. semiconductor wire bonding has long been a business tenet of Rocket PCB Solution Ltd.. Please contact us! Rocket PCB Solution Ltd. ensure ic wire bonding service for its costumers. Please contact us! aluminum wire bonding process is the central tenet of all our members. Please contact us! Focusing on building a future-oriented wire bonding is our aim. Please contact us!
The materials Rocket PCB aluminum wire bonding process uses have been well selected and strictly tested.
Drafted by our professional team, the appearance of semiconductor wire bonding looks very attractive.
The needs of designing latest wire bonding is the fostering of a vibrant and dynamic Rocket PCB.
Top-quality details perfectly shown on Rocket PCB aluminum wire bonding process.
Rocket PCB aluminum wire bonding process is of a functional design without compromising on the overall appearance.
The product is tested under the vigilance of our proficient professionals who clearly know quality standards in the industry.
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: hans.hu@rocket-pcb.com welcome to consult!