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Wire bonding ENEPIG PCB bonding PCB gold wire bonding

Wire bonding ENEPIG PCB bonding PCB gold wire bonding

Wire bonding ENEPIG PCB bonding PCB gold wire bonding

Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
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Quantity Needed:
Pieces
E-mail:
Application Scope
Rocket PCB's printed circuit board is commonly used in the following industries.In addition to providing high-quality products, Rocket PCB also provides effective solutions based on the actual conditions and the needs of different customers.
Enterprise Strength
  • Rocket PCB integrates facilities, capital, technology, personnel, and other advantages, and strives to offer special and good services.
Company Advantages
1. Rocket PCB wire bonding is manufactured using state-of-the-art technology to guarantee the fine workmanship and smooth production.
2. A series of strict pre-delivery testing is carried out to eliminate the defect product. The testing is strictly conducted by our testing personnel and thus the quality of this product can be guaranteed.
3. The quality of the product is guaranteed by our state-of-the-art facilities and advanced technology. Its quality has passed the strict test and is examined frequently. Thus its quality has been widely accepted by the users.
4. Only qualified wire bonding can be packed in Rocket PCB Solution Ltd..
5. Rocket PCB Solution Ltd. has formulated a strict quality control system and the operation flow.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

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methods


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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Wire bonding ENEPIG PCB bonding PCB gold wire bonding-3



Product application


Wire bonding ENEPIG PCB bonding PCB gold wire bonding-4                
Consumer electronics
Wire bonding ENEPIG PCB bonding PCB gold wire bonding-5                
Automotive electronics
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Communications
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Energy
Wire bonding ENEPIG PCB bonding PCB gold wire bonding-8                
Industrial & Instrumentation
Wire bonding ENEPIG PCB bonding PCB gold wire bonding-9                
IOT/Smart Home
Wire bonding ENEPIG PCB bonding PCB gold wire bonding-10                
Medical electronics
Wire bonding ENEPIG PCB bonding PCB gold wire bonding-11                
Security Industry

Company Features
1. Rocket PCB Solution Ltd. mainly manufacturing wire bonding by advanced technology and superior material.
2. Rocket PCB Solution Ltd. has accelerated the construction of technology in production of Rocket PCB Solution Ltd..
3. Rocket PCB Solution Ltd. will keep working hard and win the leading position in the industry. Please contact. Rocket PCB Solution Ltd. intends to serve each client well. Please contact.
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!