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wholesale wire bonding technology professional wire for automotive

wholesale wire bonding technology professional wire for automotive
  • wholesale wire bonding technology professional wire for automotive
  • wholesale wire bonding technology professional wire for automotive

wholesale wire bonding technology professional wire for automotive

Rocket PCB wire bonding technology meets the international standard for electrical appliances. No matter is the quality of electric parts or the housing and insulation material, they all made strictly according to regulations. With a firm and solid structure, it is anti-collision
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wholesale wire bonding technology professional wire for automotive-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Rocket PCB wire bonding technology is the outcome of complicated electric knowledge. It is developed taking many things into consideration, including the design of circuit boards, components, circuits, and the whole product shape. It has served over 2600 customers since its launch
Rocket PCB wire bonding technology is manufactured in line with the strictest sanitary ware standards. From the selection of the materials, the workmanship, to the quality inspection, are all carried out based on specific regulations. The product itself has a heat-resisting property
Rocket PCB wire bonding technology is meticulously crafted. Its manufacturing process is based on a high level of expertise in creative development, engineering, and printing. With a multi-layered polished surface, it ensures its durability and reliability
The quality inspection for Rocket PCB wire bonding technology covers several parts. It will be scrutinized for its strength, anti-bending capability, fineness, color aberration, and thermal stability. The center of the product is highly consistent
The design of Rocket PCB wire bonding technology is a combination of various technologies. They are mainly automation, intelligence, sensing, computer science, and mechanical engineering technologies. With a multi-layered polished surface, it ensures its durability and reliability
wire bonding technology has wide application and promotion value in wire bonding technology industry. Its materials decide its excellent rain and dust resistance
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