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methods

Common PCB plating and wire bonding methods include

◪ Aluminum Wedge Wire Bonding and ENIG Plating

◪ Gold Ball Wire Bonding and soft gold plating

◪ Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Product application

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Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

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Medical electronics

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Security Industry

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Thanks to the low cost of raw materials and the high efficiency of streamlined production, wire bonding technology products have the advantage of high gross profit margin. The product is widely applied in consumer electronics

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Rocket PCB wire bonding technology comes in a variety of wonderful designs. It is subjected to extreme heat and soldered into place

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High technical assurance and first-class quality can be seen on wire bonding technology. It reduces the component welding points and is possible in the reduction of the failure rate

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All raw materials used to manufactured Rocket PCB wire bonding technology have to go through stringent quality checking procedure. It offers a simple platform to arrange the electronic components in a compressed way

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The design of Rocket PCB wire bonding technology focuses on the technique and function. The product reduces the possibility of loose connections or short circuit

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wire bonding technology has advantages both in cost, reliability and long life, in comparison with other similar products. Its connections made automatically through copper tracks