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wholesale wire bonding technology professional wire for automotive

wholesale wire bonding technology professional wire for automotive
  • wholesale wire bonding technology professional wire for automotive
  • wholesale wire bonding technology professional wire for automotive

wholesale wire bonding technology professional wire for automotive

Rocket PCB wire bonding technology is designed by a team of experienced experts using the latest design concept based on a strict design process.
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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

The production technology of Rocket PCB wire bonding technology is advanced, which is in line with the industry standards.
Efficient production process: the production process of Rocket PCB wire bonding technology has been streamlined and the efficient production process minimizes waste and brings the product to market in the most cost-effective manner possible.
Rocket PCB wire bonding technology is delicately manufactured by combining the best materials and the lean production method.
Reliable raw materials: the raw materials of Rocket PCB wire bonding technology are all sourced from the suppliers who have established long term reliable cooperation with us. Their products are all certified.
Rocket PCB wire bonding technology is designed using the latest design concept and manufactured from quality raw materials sourced from reliable suppliers.
wire bonding technology is made of high-quality components and parts. It has the advantages of fast charging speed, easy maintenance and maintenance, and light and convenient portability. It is favored by customers in the market.
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