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wholesale wire bonding technology professional wire for automotive

wholesale wire bonding technology professional wire for automotive
  • wholesale wire bonding technology professional wire for automotive
  • wholesale wire bonding technology professional wire for automotive

wholesale wire bonding technology professional wire for automotive

The quality inspection of Rocket PCB wire bonding technology will be carried out throughout the production stage. It will be checked for the insulation of wires, the performance of insulation resistance, nominal voltage, and other electric components. The load characteristics of this product are reasonably good
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wholesale wire bonding technology professional wire for automotive-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Rocket PCB wire bonding technology is manufactured exquisitely. It is produced under precise processing technology to assure the cutting, heat treating, polishing, and other workmanship are precisely done. This product features a super long cycle lifespan
Rocket PCB wire bonding technology is manufactured by advanced machinery. It is processed accordingly by water jet, CNC, casting machine, baking machine, infrared bridge cutting machine, and so on. This product features relatively low self-discharge
Rocket PCB wire bonding technology conforms to the electrical safety standards. Its wires and cables, plug, switching power system, and electric components such as conductor and resistor are tested to comply with relevant standards. Its fast charging ability help minimize downtime
The manufacturing process of Rocket PCB wire bonding technology covers a few parts, namely, mechanical drawing design, raw materials preparation, work blank fabrication, casting of components and parts, as well as assembly and testing.
Rocket PCB wire bonding technology has gone through a series of precision testing for details. It is tested for drilling depth, pitch, and edge sharpness. This product is characterized by its drop-in replacement
The product is able to resist abrasions. It can withstand abrasion caused by scraping or rubbing which will affect its original physical property. This product is distinguished by its good power performance
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