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wholesale wire bonding technology professional wire for automotive

wholesale wire bonding technology professional wire for automotive
  • wholesale wire bonding technology professional wire for automotive
  • wholesale wire bonding technology professional wire for automotive

wholesale wire bonding technology professional wire for automotive

Rocket PCB wire bonding technology goes through elaborate design steps. They are problem definition, basic need definition, material analysis, detailed design, and preparation of drawing. Our professional staff are on call 24 hours a day, 7 days a week for you
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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


wholesale wire bonding technology professional wire for automotive-2                
Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Rocket PCB wire bonding technology goes through professional design. It is created by experts who have vast knowledge and experience in the following standards: IP Protection, UL, CE, environment and explosive Std, CSA, FM, etc. Our products are of high precision with tolerance of ±0.1mm
Rocket PCB wire bonding technology is finely developed by the R&D staff. It is built with various characteristics under the concept of high techs, such as shock-proof, scratch-resistant, and corrosion-resistance capacities in mechanical working conditions. We can also apply silk-screening treatment which suits some applications better
Rocket PCB wire bonding technology has a professional design. It is designed by specialists who master the fundamentals of designing the most commonly used parts, elements, and units of various machines. Anodizing improves corrosion protection, surface hardness, wear resistance, aesthetic appearance and the adhesion of paints and primers. Gaojie is very professional in giving anodizing treatment to different materials for prototyping process
During the design of Rocket PCB wire bonding technology, different technologies have been adopted. Its sketch design will be carried out using computer-aided design (CAD) and computer-aided manufacturing (CAM). With Gaojie sanding and polishing, we can achieve highly finished surfaces up to mirror polish, suitable for stainless steel, aluminum and PMMA type plastics
Rocket PCB wire bonding technology is developed according to the basic law of the construction of machines, including the drive system, operate and control system, and the supporting device working principle. Our experience, broad capabilities, and efficient prototyping technologies can bring your design to life more quickly
The product is highly resistant to corrosion. Constructed from heavy-duty metal materials that have passed the salt spray test, it is impervious to chemicals. Gaojie Model has been committed to innovation and development of industrial 3D printing technology in various industries for many years and has served for many leading companies
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