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wholesale wire bonding technology finished surface finished for digital device

wholesale wire bonding technology finished surface finished for digital device
  • wholesale wire bonding technology finished surface finished for digital device
  • wholesale wire bonding technology finished surface finished for digital device

wholesale wire bonding technology finished surface finished for digital device

In the manufacture of Rocket PCB wire bonding technology, a range of techniques have been used, from CAD design, 3D imaging, model manufacturing, to final assembly. Due to its flexibility, the product will not cause discomfort to the patient
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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

The development and design of Rocket PCB wire bonding technology is a complex process with medical industry regulations, specifications, application requirements, and patients' needs. The product has been certified under CE
Typical parameters of Rocket PCB wire bonding technology being measured include flexure, tension, compression, peel strength, adhesive/bond strength, puncture, insertion/extraction and sliding of pistons. The product can be disinfected under high temperatures
Rocket PCB wire bonding technology has been tested by the third-party testing organization in terms of mechanical testing, product qualification, material characterization, and microbiological evaluation. This product is antibacterial, providing no living space for bacteria
The inspection of Rocket PCB wire bonding technology involves precision measurement. It is tested to comply with international medical standards and regulations. The product has compatibility with living tissue
Rocket PCB wire bonding technology is professionally designed. It is carried out by our robust team who use advanced tools to design medical products with complex mechanical and electromechanical systems. The product features bending resistance and is not easy to break off
The product is quality-assured and holds many international certificates, such as ISO certificate. The product is not impervious to fade and yellowing
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