loading
Rocket PCB  >  AI - Page Sitemap  >  wholesale wire bonding technology finished surface finished for digital device
wholesale wire bonding technology finished surface finished for digital device

wholesale wire bonding technology finished surface finished for digital device
  • wholesale wire bonding technology finished surface finished for digital device
  • wholesale wire bonding technology finished surface finished for digital device

wholesale wire bonding technology finished surface finished for digital device

Professional design: the design of Rocket PCB wire bonding technology is finished by a team of professionals. They are fully equipped with the industry know-how and design the product by utilizing the most professional knowledge. Reduced friction of this product helps prevent blisters
Inquire Online
Get the latest price
Quantity Needed:
Pieces
E-mail:

methods

wholesale wire bonding technology finished surface finished for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


wholesale wire bonding technology finished surface finished for digital device-2                
Consumer electronics
wholesale wire bonding technology finished surface finished for digital device-3                
Automotive electronics
wholesale wire bonding technology finished surface finished for digital device-4                
Communications
wholesale wire bonding technology finished surface finished for digital device-5                
Energy
wholesale wire bonding technology finished surface finished for digital device-6                
Industrial & Instrumentation
wholesale wire bonding technology finished surface finished for digital device-7                
IOT/Smart Home
wholesale wire bonding technology finished surface finished for digital device-8                
Medical electronics
wholesale wire bonding technology finished surface finished for digital device-9                
Security Industry

Rocket PCB wire bonding technology is manufactured by adopting advanced production technologies. These technologies are constantly updated and improved to meet the industry standards and thus the product can be provided with long-lasting and strong functionality. Being non-slip is a big selling point of this product
Rocket PCB wire bonding technology is delicately manufactured by the use of cutting edge technology. It helps to promote natural foot alignment
The raw materials of Rocket PCB wire bonding technology undergo a strict selection and screening process. It creates the best fit and support during sugged or strenuous wear
Rocket PCB wire bonding technology is provided with appealing designs and compact structure. It is completely waterproof and UV resistant
Advanced technology and latest machine & equipment are used to ensure Rocket PCB wire bonding technology is manufactured based on the requirements of lean production. Reduced friction of this product helps prevent blisters
The product has good environmental adaptability. It is not easily affected by vibration, shock, bump, extrusion, dropping, and temperature. It creates the best fit and support during sugged or strenuous wear
Product Message
Chat Online
Chat Online
Leave Your Message inputting...
Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, and we will reply to you ASAP. Welcome, what can I help you?
Sign in with: