Rocket PCB  >  AI - Page Sitemap  >  wholesale wire bonding technology finished surface finished for digital device
wholesale wire bonding technology finished surface finished for digital device

wholesale wire bonding technology finished surface finished for digital device
  • wholesale wire bonding technology finished surface finished for digital device
  • wholesale wire bonding technology finished surface finished for digital device

wholesale wire bonding technology finished surface finished for digital device

The design of Rocket PCB wire bonding technology covers sophisticated steps. It includes information collecting of the latest furniture designs and trends, sketch drawing, sample making, assessment, and production drawing. It has many unique shapes and sizes to keep itself interesting
Inquire Online
Get the latest price
Quantity Needed:
Pieces
E-mail:

methods

wholesale wire bonding technology finished surface finished for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


wholesale wire bonding technology finished surface finished for digital device-2                
Consumer electronics
wholesale wire bonding technology finished surface finished for digital device-3                
Automotive electronics
wholesale wire bonding technology finished surface finished for digital device-4                
Communications
wholesale wire bonding technology finished surface finished for digital device-5                
Energy
wholesale wire bonding technology finished surface finished for digital device-6                
Industrial & Instrumentation
wholesale wire bonding technology finished surface finished for digital device-7                
IOT/Smart Home
wholesale wire bonding technology finished surface finished for digital device-8                
Medical electronics
wholesale wire bonding technology finished surface finished for digital device-9                
Security Industry

Rocket PCB wire bonding technology is designed by professional furniture designers. They approach the product from a practical point of view as well as aesthetics view, making it in line with the space. It is protected with a coated surface resistant to water drops
Rocket PCB wire bonding technology is analyzed and inspected on the basis of strict quality requirements. It has passed the inspection of appearance, physical properties, finishing properties, colorfastness, etc. There is only a minimum of chipping and fuzzing on its back, which can be sanded off
The design concept of Rocket PCB wire bonding technology is framed properly. It has successfully combined functional and aesthetic perspectives into a three-dimensional design. It is protected with a coated surface resistant to water drops
During the design phase, several factors of Rocket PCB wire bonding technology have been taken into account. They include structural&visual balance, symmetry, unity, variety, hierarchy, scale, and proportion. It has many unique shapes and sizes to keep itself interesting
Various on-site tests for Rocket PCB wire bonding technology have been performed to assess its compliance. They include color shading, seam quality, measurements, labeling, and packaging. Each puzzle piece fits perfectly into the adjacent piece
wire bonding technology get great attention for excellent properties such wire bonding technology. It can be used to boost skills: hand-eye coordination, motor skills, problem-solving, etc
Product Message
Chat Online 编辑模式下无法使用
Chat Online inputting...
Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!