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wholesale wire bonding technology finished surface finished for digital device

wholesale wire bonding technology finished surface finished for digital device
  • wholesale wire bonding technology finished surface finished for digital device
  • wholesale wire bonding technology finished surface finished for digital device

wholesale wire bonding technology finished surface finished for digital device

Rocket PCB wire bonding technology is elaborately manufactured using the latest advanced technology and production method.
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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Rocket PCB wire bonding technology is designed with a compact size and beautiful appearance.
The design of Rocket PCB wire bonding technology is carefully considered from the perspective of users.
Rocket PCB wire bonding technology is manufactured using state-of-the-art technology based on the principles of lean production.
Excellent craftsmanship: Rocket PCB wire bonding technology is crafted with excellent craftsmanship which is a result of talents and skills. Its superior craftsmanship makes it high quality.
Standard manufacturing: Rocket PCB wire bonding technology is manufactured adopting the highest production standards at home and abroad. These standards include quality production system and operating system.
This product is weatherproof. Materials that can withstand damage from harsh UV rays and fluctuations from extreme heat to cold are used.
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