Rocket PCB  > 

AI - Page Sitemap

 > 

wholesale wire bonding technology finished surface finished for automotive

wholesale wire bonding technology finished surface finished for automotive

Wholesale wire bonding technology finished surface finished for automotive

Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Comparison
PCB prototyping, manufactured based on high-quality materials and advanced technology, has excellent quality and favorable price. It is a trustworthy product which receives recognition and support in the market.PCB prototyping has the following advantages over other products in the same category.
Application Scope
Rocket PCB's printed circuit board is widely used in the Manufacturing Electrical Equipment & Supplies PCB & PCBA industry and is widely recognized by customers.Rocket PCB is committed to producing quality printed circuit board and providing comprehensive and reasonable solutions for customers.
Company Advantages
1. Rocket PCB simple pcb board is manufactured utilizing quality checked material that are obtained from the most trusted vendors of the industry.
2. The product brings optimized dehydrating effect. The hot wind of the circulation is able to penetrate into each side of each piece of the food, without affecting its original luster and flavors.
3. The product is anti-UV. The gel coating is applied to this product, providing a layer of protection to withstand sunlight exposure.
4. Rocket PCB Solution Ltd. is committed to providing outstanding technical services to our clients.
5. From material selection to production process of wire bonding technology , Rocket PCB Solution Ltd. strictly control every detail.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

wholesale wire bonding technology finished surface finished for automotive-1


methods


wholesale wire bonding technology finished surface finished for automotive-2

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



wholesale wire bonding technology finished surface finished for automotive-3



Product application


wholesale wire bonding technology finished surface finished for automotive-4                
Consumer electronics
wholesale wire bonding technology finished surface finished for automotive-5                
Automotive electronics
wholesale wire bonding technology finished surface finished for automotive-6                
Communications
wholesale wire bonding technology finished surface finished for automotive-7                
Energy
wholesale wire bonding technology finished surface finished for automotive-8                
Industrial & Instrumentation
wholesale wire bonding technology finished surface finished for automotive-9                
IOT/Smart Home
wholesale wire bonding technology finished surface finished for automotive-10                
Medical electronics
wholesale wire bonding technology finished surface finished for automotive-11                
Security Industry

Company Features
1. Rocket PCB Solution Ltd. is a wire bonding technology manufacturer aimed at global market.
2. By keeping innovating the printed circuit board industry technology, we can stay ahead in the industry.
3. The goal of Rocket PCB Solution Ltd. is to take the leading edge in the wire bonding process industry. Contact! The ultimate goal of Rocket PCB Solution Ltd. is to achieve continuous improvement in product quality and service. Contact!
Product Message
Chat Online 编辑模式下无法使用
Chat Online inputting...
Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!