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wholesale wire bonding services wire surface finished for electronics

wholesale wire bonding services wire surface finished for electronics
  • wholesale wire bonding services wire surface finished for electronics
  • wholesale wire bonding services wire surface finished for electronics
  • wholesale wire bonding services wire surface finished for electronics

wholesale wire bonding services wire surface finished for electronics

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing...
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Company Advantages
1. Rocket PCB wire bonding services is rich in modern design styles that are designed by our experts. Its compact design takes less space in a piece of application equipment
2. A commitment to a customer service ideology is essential for Rocket PCB Solution Ltd.. It reduces the component welding points and is possible in the reduction of the failure rate
3. This product has the required precision. It provides enough dynamic precision for the program without any human error. It makes the interconnections less bulky

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

wholesale wire bonding services wire surface finished for electronics-1


methods


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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



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Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. With years of evolution, Rocket PCB Solution Ltd. has been one of the most reliable manufacturers and suppliers of wire bonding services . We have been widely accepted in the industry. The employees are the energy that drives our company forward. They predictably execute strategy, meet goals, and need little management oversight. They are the asset that makes it possible for the company to accomplish ambitious projects.
2. We have a loyal and strong customers base who have been maintaining business relationships with us for years. This is because we spend many efforts in developing innovative and suitable products for them and always offer our best services.
3. Strong scientific research capabilities make Rocket PCB Solution Ltd. ahead of other companies in the wire bonding technology industry. Fully implementing the strategy of aluminum wire bonding process boosts the development of Rocket PCB. Contact us!
Rocket PCB wire bonding services is designed complying with the principle of aesthetics and functionality by the designers who have created many novel items and won the designing prize in the gift&craft industry. Featuring formula stability, it can keep stable even exposed to the bright light or heat
The freezing technology of Rocket PCB wire bonding technology has been significantly improved to reduce the harmful impacts of chemical refrigerants on the environment. The product has no unpleasant odor at all
Rocket PCB wire bonding technology is provided with the highest standard of durability and quality. Our production team adopts with the RTM technology to create superior product with structural strength. The product is formulated to be caffeine-free
The hardware components of Rocket PCB wire bonding technology have been tested by a third-party testing organization, passing the FCC, CE and ROHS safety certification. The product has been certified under SGS
Rocket PCB aluminum wire bonding process is strictly inspected. It is carried out by our QC team who checks its flammability, tension, corrosion resistance, and other performance characteristics. The product can be manufactured based on customized formulation
The design of wire bonding technology is based on wire bonding technology. It has such characteristics as wire bonding technology. It can be supplied with different sizes to meet customers' needs
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!