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wholesale wire bonding process professional surface finished for automotive

wholesale wire bonding process professional surface finished for automotive
  • wholesale wire bonding process professional surface finished for automotive
  • wholesale wire bonding process professional surface finished for automotive
  • wholesale wire bonding process professional surface finished for automotive

wholesale wire bonding process professional surface finished for automotive

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing...
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Rocket PCB is certified by various qualifications. We have advanced production technology and great production capability. PCB prototype has many advantages such as reasonable structure, excellent performance, good quality, and affordable price.Compared with other products in the same category, PCB prototype has the following major features.
  • wholesale wire bonding process professional surface finished for automotive-PCB prototype-pcb fabric
    wholesale wire bonding process professional surface finished for automotive-pcb fabrication, PCB mak
Company Advantages
1. A team of skilled employees designs and manufactures Rocket PCB simple pcb board by making use of supreme quality material with the aid of avant-garde tools & machines.
2. The product is not prone to fade. The fine finish guards against it from the influence of UV rays and strong sunlight.
3. The product does not have appearance defections. It has been inspected under FZ/T 01075-2010 which aims to check its seams, line, stains, or spots.
4. With the above mentioned high safety advantage, people can rest assured that it is not likely to cause fire hazards because of poor electric performance.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

wholesale wire bonding process professional surface finished for automotive-1


methods


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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



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Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. is a company strong in designing and manufacturing simple pcb board. Over the past years, we have become one of the leading suppliers in the industry.
2. The support of experienced aluminum wire bonding process technicians helps to manufacture good wire bonding process .
3. Rocket PCB looks forward to working with you by providing our fantastic wire bonding pcb . Inquire now! Rocket PCB Solution Ltd. is a company with lofty wishes and great ideals. It is a world-renowned semiconductor wire bonding supplier. Inquire now!
The structure of wire bonding pcb is frequently renovate to make it be characterized by wire bonding pcb. Since all parts are designed reasonably, it is very easy to assemble
We update aluminum wire bonding process with modern technology frequently, making it wire bonding process. Its materials have less undesirable effects on the environment
The design of wire bonding pcb is obviously more superior than similar types of products in market. Its compact structure and beautiful texture can surprisingly highlight decor in the applied places
aluminum wire bonding process is a kind of aluminum wire bonding process with rational structure and excellent efficiency. The product has been proved to have no foul smell
Even with the high cost for superior raw material, Rocket PCB Solution Ltd. firmly believe good quality of semiconductor wire bonding is everything. The product is manufactured to resist moisture
The product has properties of long service, excellent and stable performance. Its materials have less undesirable effects on the environment
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: hans.hu@rocket-pcb.com welcome to consult!