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wholesale wire bonding pcb wire bulk fabrication for electronics

wholesale wire bonding pcb wire bulk fabrication for electronics
  • wholesale wire bonding pcb wire bulk fabrication for electronics
  • wholesale wire bonding pcb wire bulk fabrication for electronics
  • wholesale wire bonding pcb wire bulk fabrication for electronics

wholesale wire bonding pcb wire bulk fabrication for electronics

As a rapidly growing company, Rocket PCB Solution Ltd. has grasped the market opportunity to grow into an expert in the manufacturing of wire bonding pcb .
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Company Advantages
1. All raw materials of Rocket PCB semiconductor wire bonding are subjected to intense and systematic quality control in our factory. Thanks to the application of the shielding layer, its signal distortion is reduced
2. Rocket PCB Solution Ltd. pursues meticulous production and has made careful calculations on management. Its components are always soldered in, which contributes to durability
3. The product features desirable safety. The ammonia refrigerant used has a characteristic odor that can be detected by humans even at very low concentrations. Its parts are spaced evenly and traces are symmetric and uniform
4. The product performs stably without little vibration. The design helps balance itself and keep stabilized during the dehydrating process. It makes the interconnections less bulky

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

wholesale wire bonding pcb wire bulk fabrication for electronics-1


methods


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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



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Product application


wholesale wire bonding pcb wire bulk fabrication for electronics-4                
Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
wholesale wire bonding pcb wire bulk fabrication for electronics-10                
Medical electronics
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Security Industry

Company Features
1. As a rapidly growing company, Rocket PCB Solution Ltd. has grasped the market opportunity to grow into an expert in the manufacturing of wire bonding pcb .
2. Rocket PCB actively introduces high-end talents.
3. Rocket PCB shares a dedication to sensing, serving, and satisfying the needs of customers in wire bonding technology market. Inquire now!
The safety of Rocket PCB wire bonding technology is guaranteed by the standards it passed. This product is fabricated complying with EMC standards, electric compatibility standards, and overload protection. Its dimensional stability makes it not prone to mechanical forces
The preparation process of Rocket PCB wire bonding pcb includes a few steps. Materials crushing, grinding, separating, and refining are conducted by professional technicians who have many years of experience in mineral extraction and refinery. It has the property to resist the scratch of a sharp object
Each and every Rocket PCB wire bonding pcb that leaves our factory has undergone and passed stringent strength testing in terms of strip tensile, tear, and seam strength. This product features precise shapes and dimensional tolerances
The line endows Rocket PCB wire bonding pcb a good design. It is created by details such as seams, openings, pleats, gathers, tucks, topstitching, and trims. And it defines the forms and shapes of this product. Its thicknesses, widths, and lengths are highly customizable according to the needs of customers
The materials used to make Rocket PCB semiconductor wire bonding are toxic free and safe for users and the environment. They are tested for low emission (low VOCs).
It is highly resistant to impact and shock. In material processing, in order to enhance its capacity against exterior damage, impact modifier is used in the materials. This product has been applied in many industries such as petroleum chemical, metallurgy, pharmaceutical machinery, paper making, food, and shipbuilding
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!