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wholesale printed circuit board industry gold wire for digital device

wholesale printed circuit board industry gold wire for digital device
  • wholesale printed circuit board industry gold wire for digital device
  • wholesale printed circuit board industry gold wire for digital device

wholesale printed circuit board industry gold wire for digital device

Rocket PCB printed circuit board industry is upgraded from time to time as per the latest technological innovations. Its components are always soldered in, which contributes to durability
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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Thanks to the low cost of raw materials and the high efficiency of streamlined production, printed circuit board industry products have the advantage of high gross profit margin. It takes less time in assembling a circuit as compared to the conventional method
Rocket PCB printed circuit board industry comes in a variety of wonderful designs. The software program arranges its parts for best performance
High technical assurance and first-class quality can be seen on printed circuit board industry. Its assembly process is conducted by a computer, leaving very little room for error
All raw materials used to manufactured Rocket PCB printed circuit board industry have to go through stringent quality checking procedure. It is specifically designed to lessen the chances of shorts and wiring issues
The design of Rocket PCB printed circuit board industry focuses on the technique and function. It is the perfect choice for manufacturers of electronic components, instruments, and equipment
printed circuit board industry has advantages both in cost, reliability and long life, in comparison with other similar products. It offers a simple platform to arrange the electronic components in a compressed way
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