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wholesale printed circuit board industry gold wire for digital device

wholesale printed circuit board industry gold wire for digital device
  • wholesale printed circuit board industry gold wire for digital device
  • wholesale printed circuit board industry gold wire for digital device

wholesale printed circuit board industry gold wire for digital device

Material of printed circuit board industry is highly prized in Rocket PCB Solution Ltd.. The product features high- and low-temperature resistance
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wholesale printed circuit board industry gold wire for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
wholesale printed circuit board industry gold wire for digital device-4                
Communications
wholesale printed circuit board industry gold wire for digital device-5                
Energy
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Industrial & Instrumentation
wholesale printed circuit board industry gold wire for digital device-7                
IOT/Smart Home
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Medical electronics
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Security Industry

To enhance the competitiveness, Rocket PCB also pays attention to the design of printed circuit board industry. The adoption of high-density rubber helps the increased sealing property of the product
In order to be the leading printed circuit board industry manufacturers, our experts also focuses on its design. With an advanced aluminum E-cap, it has better electrical conductivity
With the changes of the society, customers also pay more attention to the design of printed circuit board industry. It has a fast speed for charging and discharging
printed circuit board industry outshine other similar products due to its printed circuit board industry materials. With a tough texture, it is not easy to seep
It is the unique design that makes printed circuit board industry more competitive in the market. Its aluminum foil is not easy to break
The product is featured by fine finish, durability and optimal performance. With an advanced aluminum E-cap, it has better electrical conductivity
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