wholesale ic wire bonding wire wire for electronics

Company Advantages
1. The design of Rocket PCB is a consequence of many combined parameters. Geometry, materials, surface area design, and air velocity are all seriously considered in enhancing the performance of the product. Thanks to the application of the shielding layer, its signal distortion is reduced
2. This product will keep a comfortable and improved sleep as its fabric will help suck away moisture throughout the night. The product reduces the possibility of loose connections or short circuit
3. The product is resistant to vibration. It is not affected by the movements of the device or the external factors. All the components within this product are fixed using solder flux

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Company Features
1. We have increased customer base in recent years. The customer retention rate has increased by 5%, mainly because we continuously maximize customer’s lifetime values during cooperation.
2. Rocket PCB Solution Ltd. solely concentrates on exporting therefore, we offer very competitive prices. Call!