top quality pcb industry packaging communicative equipment for sale

Top quality pcb industry packaging communicative equipment for sale

Name:: IC substrates

Material:: FR4

Board thickness:: 1.6mm

Surface treatment:: Immersion Gold

Technology:: Microvia Manufacturing, patterning and copper plating control, product reliability test technology

Payment:: L/C,T/T,Western Union

Certification:: UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)

Delivery Term：: DDU, FOB, CFA, CIF, CPT, EXW

Price: Get Latest Price

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Product Information

Product Comparison

Rocket PCB pays great attention to integrity and business reputation. We strictly control the quality and production cost in the production. All these guarantee printed circuit board to be quality-reliable and price-favorable.printed circuit board is more competitive than other products in the same category, as shown in the following aspects.

Enterprise Strength

We promise choosing Rocket PCB is equal to choosing quality and efficient services.

Company Advantages
1. Rocket PCB pcb industry is designed utilizing the ideal guaranteed crude material and modern methods.
2. The product quality completely conforms to the industry standard.
3. Our team has rich experience in manufacturing pcb industry , independent research and software & hardware development.
4. The trend toward increased productivity of Rocket PCB Solution Ltd. has meant lower prices of its Rocket PCB.

About our product

IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates are endowed with critical functions including circuit support and protection, heat dissipation, and signal and power distribution.
IC substrates represent the highest level of miniaturization in PCB manufacturing and share many similarities with semiconductor manufacturing. Rocket PCB produces many types of IC substrates on which IC chips are attached to the IC substrate utilizing wire bonding or flip chip methods.

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Advanced technology that Rocket PCB adopts for the IC substrates manufacturing includes:

◪ CSP (Chip Scale Packages)

◪ FC-CSP (Flip Chip) CSP

◪ COB (Chip on Board)

◪ PoP (Package on Package)

◪ COB (Chip on Board)

◪ PiP (Package in Package)

◪ SiP (System in Package)

◪ RF Module

◪ LED Package

Product application

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Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

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Medical electronics

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Security Industry

Company Features
1. Rocket PCB Solution Ltd. takes superiority in the manufacturing of pcb products. We have already enhanced competence in today's fierce market competition.
2. We adopt world-advanced technology when manufacturing pcb industry .
3. Our production is driven by innovation, responsiveness, cost reduction and quality control. This allows us to deliver the top quality, competitively priced products for customers. Inquire now! Our commitment is to provide the highest quality of products and services with the most competitive prices to our customers. Inquire now! Our company bears social responsibility. Sustainability considerations are always the key part of decision-making in our product development.

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top quality pcb industry packaging communicative equipment for sale

Top quality pcb industry packaging communicative equipment for sale

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