Company Advantages
1. Rocket PCB wire bonding technology is made of materials that are rigorously selected to meet the furniture processing requirement. Several factors will be considered when selecting materials, such as processability, texture, appearance quality, strength, as well as economical efficiency. The product reduces the possibility of loose connections or short circuit
2. plays a vital role in maintaining the quality of wire bonding technology .
3. It meets the client’s requirement in every term of quality and durability. It is specifically designed to lessen the chances of shorts and wiring issues

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Company Features
1. With so many high-quality products like delivered around the world, Rocket PCB Solution Ltd. has become a truly reliable manufacturer and supplier. With salient capability in technology, Rocket PCB Solution Ltd. is superior than other companies in output and quality of wire bonding technology .
2. printed circuit board industry is processed by experienced technicians of Rocket PCB.
3. Rocket PCB Solution Ltd. is technologically leading as a aluminum wire bonding process manufacturer. We are devoted to being socially responsible. All of our business actions are socially-responsible business practices, such as producing products that are safe to use and friendly to the environment.