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top brand wire bonding technology finished wire for electronics

top brand wire bonding technology finished wire for electronics
  • top brand wire bonding technology finished wire for electronics
  • top brand wire bonding technology finished wire for electronics

top brand wire bonding technology finished wire for electronics

methods
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Company Advantages
1. Rocket PCB wire bonding technology is made of materials that are rigorously selected to meet the furniture processing requirement. Several factors will be considered when selecting materials, such as processability, texture, appearance quality, strength, as well as economical efficiency. The product reduces the possibility of loose connections or short circuit
2. plays a vital role in maintaining the quality of wire bonding technology .
3. It meets the client’s requirement in every term of quality and durability. It is specifically designed to lessen the chances of shorts and wiring issues

methods


top brand wire bonding technology finished wire for electronics-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


top brand wire bonding technology finished wire for electronics-2                
Consumer electronics
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Automotive electronics
top brand wire bonding technology finished wire for electronics-4                
Communications
top brand wire bonding technology finished wire for electronics-5                
Energy
top brand wire bonding technology finished wire for electronics-6                
Industrial & Instrumentation
top brand wire bonding technology finished wire for electronics-7                
IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. With so many high-quality products like delivered around the world, Rocket PCB Solution Ltd. has become a truly reliable manufacturer and supplier. With salient capability in technology, Rocket PCB Solution Ltd. is superior than other companies in output and quality of wire bonding technology .
2. printed circuit board industry is processed by experienced technicians of Rocket PCB.
3. Rocket PCB Solution Ltd. is technologically leading as a aluminum wire bonding process manufacturer. We are devoted to being socially responsible. All of our business actions are socially-responsible business practices, such as producing products that are safe to use and friendly to the environment.
Rocket PCB wire bonding technology is manufactured by our professional team, meeting the highest safety standards in the water parks industry while delivering entertainment, joy, and comfort. It is available in different dimensions meeting the USA and Euro standards
Rocket PCB wire bonding technology undergoes a series of production methods such as sanding, painting, and ovendry. All these methods are strictly carried out by our professional workers. Its shape won't deform easily caused by internal pressure
During the production, Rocket PCB aluminum wire bonding process has to go through a series of processes such as CAD shape design, high temperature and pressure molding, stamping, sewing or stitching, etc. Using recyclable material, it is quite eco-friendly
Once Rocket PCB wire bonding technology is removed from the mold, it has to undergo further processing. It will be added to a variety of finishes and textures to add an aesthetic touch. It can be provided with a spear and coupler
Removal of the edge, or flash, from a Rocket PCB wire bonding technology can be accomplished in a number of ways including manual tear trimming, cryogenic processing, tumbling precision grinding. The product is made of AISI 304 food-grade stainless steel, which contains no toxic substances
The product has consistent quality, stable performance, and long service life. It can function well in a high-temperature environment
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