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top brand wire bonding services surface wire for digital device

top brand wire bonding services surface wire for digital device
  • top brand wire bonding services surface wire for digital device
  • top brand wire bonding services surface wire for digital device

top brand wire bonding services surface wire for digital device

Top-notch technology used for wire bonding services definitely is superior to the similar wire bonding services in terms of [关键词]. Operated by a thermal printing method, it is able to print at much faster rates than other printers
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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Right material is extremely critical for the production of wire bonding services. The drop-in paper loading is easy to handle
Being widely recognized by more customers, it turns out to be effective that Rocket PCB needs to also pay attention to the design of wire bonding services. The product can improve workflow efficiency without a frequent ink-lacking problem
Rocket PCB Solution Ltd. attaches great importance to the design of wire bonding services. This product is certified under CCC, CE, RoHS, SAA, BIS, and BSMI
wire bonding services makes wire bonding services even more perfect than before. Printing error is less likely to happen, leading to less downtime for this product
wire bonding services with wire bonding services will highly attract customers. The drop-in paper loading is easy to handle
Our professional and skilled quality control personnel carefully check the production process of each step of the product to ensure that its quality is maintained without any defects. Operated by a thermal printing method, it is able to print at much faster rates than other printers
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