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top brand wire bonding services surface wire for digital device

top brand wire bonding services surface wire for digital device
  • top brand wire bonding services surface wire for digital device
  • top brand wire bonding services surface wire for digital device

top brand wire bonding services surface wire for digital device

Rocket PCB wire bonding services is fabricated using premium quality raw material and latest technology accordance to the various needs of the clients. It offers wide options for operators that items can be stacked upward or downward
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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Each Rocket PCB wire bonding services is highly designed and matched by our workers.
Rocket PCB wire bonding services is made employing advanced technology and sophisticated crafts. It has achieved the function of operating speed control
The raw materials of Rocket PCB wire bonding services are well prepared and are efficiently used in the production. It offers wide options for operators that items can be stacked upward or downward
The production of Rocket PCB wire bonding services is well-organized according to the lean production method. All technical parameters of the manufactured item are stored in it
The appearance design of Rocket PCB wire bonding services are in line with the industrial standards. With a full servo drive, it has a reduced clamping force, ensuring the fast and precise clamping work
This product features excellent durability. Its fabric undergoes a special treatment to achieve tensile strength, stiffness, and flexural rigidity. The product has a fast operation speed
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!