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top brand wire bonding services surface wire for digital device

top brand wire bonding services surface wire for digital device
  • top brand wire bonding services surface wire for digital device
  • top brand wire bonding services surface wire for digital device

top brand wire bonding services surface wire for digital device

Rocket PCB wire bonding services is developed professionally by our R&D team who have many years of experience in the battery industry. Parameters such as electrolyte types, metal ingredients, and battery cells have been considered respectively. The product has been certified under UL and CE
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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Rocket PCB wire bonding services is produced based on various theories. It adopts the heat management theory to check and make sure the optimized working temperature for the battery cells. The operation of this product is controlled by microcomputer
Rocket PCB wire bonding services is manufactured strictly complying with relevant standards. It has been tested under IEC, JISC, RoHS, CE, etc, and the testing result shows that its electrical property and safety performance meet the regulations. The product is energy-saving, consuming little energy
Inspection of Rocket PCB wire bonding services will be carried out by the QC team. Its appearance will be inspected to make sure the identification of polarity is correct and the battery lead is finely handled. The product is able to provide a great purifying effect
Rocket PCB wire bonding services is scrutinized by the QC team after completed. The appearance inspection, including stains, cracks, deformation, electrolyte leakage, or any other flaws that may affect the battery performance will be taken into inspection. The product is easy to clean with no blind corners
The quality of Rocket PCB wire bonding services can be guaranteed. It is manufactured according to the requirements and standards of the SANYO company. The product can ensure a high filtration rate
It is built to last. During the structure making stage, it has been built with a very sturdy and robust frame that is not likely to crack or be damaged. The product generates little noise during operation
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