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top brand wire bonding services surface wire for digital device

top brand wire bonding services surface wire for digital device
  • top brand wire bonding services surface wire for digital device
  • top brand wire bonding services surface wire for digital device

top brand wire bonding services surface wire for digital device

Rocket PCB wire bonding services is meticulously manufactured. It has gone through those manufacturing processes, namely, cutting, sewing, fiber washing, dyeing, combing, and finishing. It is widely used in the home, agriculture, health care, construction, and other industries
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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Workmanship inspection is conducted on Rocket PCB wire bonding services. Common assessments such as colorfastness to washing and rubbing, fiber strength, fiber structure, chemical agents are done by the QC team. There will not be damage marks after it is folded
Rocket PCB wire bonding services is guaranteed by quality assessment. Its manufacturing workmanships such as cutting, sewing, and dying, and some chemical agents used such as dyestuff and anti-bacterial agents are required to pass relevant tests. This product is available with ODM/OEM service
The product is quality certified for long life. The high crystallinity endows it with a good anti-corrosion effect
This product has an outstanding quality that exceeds industry standards. The PP raw materials and masterbatch used for it are non-toxic
Strict testing: the product undergoes extremely strict testing more than once to achieve its superiority over other products. The testing is conducted by our rigorous testing personnel. The surface of this product is good in gloss
Durable in use: the quality of this product is assured base on its perfect design and fine craftsmanship. Thus it can be use-durable for a long time if it is maintained properly. The product has good flexural fatigue resistance
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