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top brand wire bonding services surface wire for digital device

top brand wire bonding services surface wire for digital device
  • top brand wire bonding services surface wire for digital device
  • top brand wire bonding services surface wire for digital device

top brand wire bonding services surface wire for digital device

The development of Rocket PCB wire bonding services has to take many things into considerations. Its electric strength, potential overload, the stability of the connector, static problems, and the contact of the inner conductor are all considered seriously by the R&D team . Five star quality check is conducted to guarantee its quality
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methods


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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Rocket PCB wire bonding services has gone through a series of precision testing for details. It is tested for drilling depth, pitch, and edge sharpness. Innovation is always made to update the product and meet the market demand
The production of Rocket PCB wire bonding services utilizes a wide range of equipment which includes welding equipment, lasers equipment, impregnation equipment, spray-painting equipment, annealing and tempering ovens, and high-voltage electrical installations. Its packing is very exquisite that it directly can be a gift
The production of Rocket PCB wire bonding services is strictly in line with a series of safety standards for electric appliances. It has been checked in terms of insulation performance, overload protection, and heat dissipation performance. It has several colors such as black and silver for options
Rocket PCB wire bonding services is designed with a range of operation types, These types include automatic operation, continuous operation, synchronous operation, modular operation, etc. High heat resistant PEEK and POM are selected for its manufacturing
The manufacture of Rocket PCB wire bonding services strictly meets environmental standards. The improvements in its production process contribute to energy recovery and emission reduction. High heat resistant PEEK and POM are selected for its manufacturing
There is a protection system on this product to prevent the electrostatic discharge may lead to instantaneous high current and Highfield. The newest manufacturing methods are adopted to guarantee its appearance and feel
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