top brand wire bonding services surface wire for digital device

methods

Common PCB plating and wire bonding methods include

◪ Aluminum Wedge Wire Bonding and ENIG Plating

◪ Gold Ball Wire Bonding and soft gold plating

◪ Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Product application

Consumer electronics

Automotive electronics

Communications

Energy

Industrial & Instrumentation

IOT/Smart Home

Medical electronics

Security Industry

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The manufacture of Rocket PCB wire bonding services requires the use of different facilities. It is processed under stamping, coating, painting, and drying equipment that features high performance and efficiency. It helps minimize downtime and maximize operational efficiency

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During the design stage of Rocket PCB wire bonding services, many factors have been taken into considerations such as flexibility, cycle times, tolerances, size precision, etc. Its material is antibacterial and inhibits the growth of pathogenic microorganisms

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The development of Rocket PCB wire bonding services considered several key mechanical properties. It is developed with the stiffness, strength, hardness, ductility, and toughness which are critical for its operation. It can be designed with the front bumper to minimize walkway damage

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The design of Rocket PCB wire bonding services focuses on the basic principles of the following three areas: mechanical behavior, machine elements, and manufacturing processes. It can be designed with the front bumper to minimize walkway damage

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The materials used for Rocket PCB wire bonding services have been tested. The testing procedures include tensile testing, toughness or brittleness testing, hardness testing, infiltrate testing and testing through radiations. Its material is antibacterial and inhibits the growth of pathogenic microorganisms

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The product can be easily adjustable. It is equipped with an adjustable strap such as laces or Velcro which allows for adjustment. It can withstand hot, cold, dusty, and even grueling work environment

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CONTACT US

Office: (+86) 755 23040566

Tel: (+86) 158 9965 5195

E-mail: sales@rocket-pcb.com

Skype: Hans@Rocket-PCB

Whatsapp: 86 1589965 5195

Office Address: 2207,Bid 4,He Gu Shan Hui Cheng,35#,Guang Tian RoYanluo street, Song Gang Town,518105 SHENZHENG, CHINA

Plant ADD.: No 69, Lianfeng North Road, Xianxi Area, ChangAn Town, Dongguan, China.