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top brand simple pcb board finished wire for electronics

top brand simple pcb board finished wire for electronics
  • top brand simple pcb board finished wire for electronics
  • top brand simple pcb board finished wire for electronics

top brand simple pcb board finished wire for electronics

The design of Rocket PCB simple pcb board fully makes use of solar energy technology. Based on the characteristics of solar energy, the designers adopt the knowledge of solar energy collection, conversion, storage, and transmission.
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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

During the production of Rocket PCB simple pcb board, it is carefully checked and tested when it is wire bonded, ensuring that it has stable optical characteristics.
Rocket PCB simple pcb board undergoes a complete set of the production process. Especially the battery part has to go through welding, inspection, stamping, burr removing, pressure testing, and component testing.
Rocket PCB simple pcb board is exclusively developed by our R&D team who is exploring new raw materials without limits and experimenting with new combinations of ingredients.
Digital molding technique and meta-mechanical analysis are used in the development of Rocket PCB simple pcb board by the R&D team. The team strives to create a product with high precision which suits most people's foot arch.
The manufacture of Rocket PCB simple pcb board complies with the safety standard. Tests carried out on fabric selection, structure and accessories ensure the safety of the finished product.
simple pcb board is applicable to industries of simple pcb board.
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