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top brand simple pcb board finished wire for electronics

top brand simple pcb board finished wire for electronics
  • top brand simple pcb board finished wire for electronics
  • top brand simple pcb board finished wire for electronics

top brand simple pcb board finished wire for electronics

The cost-saving design phase of Rocket PCB simple pcb board reduces the production costs. With accurate buttons hole location, Tenchen Macbook case is suitable for Macbooks of different sizes
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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Our dedicated design team has given Rocket PCB simple pcb board an aesthetically pleasing look. Tenchen phone case is available in different colors and choices
Rocket PCB simple pcb board stands out from others for its practical and aesthetic design. Tenchen iPad case is made of the premium material such as PU leather to provide protection
The production of Rocket PCB simple pcb board is strictly in accordance with the requirements of customers. Tenchen iPad case is made of the premium material such as PU leather to provide protection
Rocket PCB simple pcb board conforms to the product design specifications. Tenchen cases showcase for lasting clarity and daily drop defense
Rocket PCB simple pcb board is made in strict accordance with the industry standard. Quality material prevents Tenchen phone case from discoloration
The product features an easy operation. It has a relatively simple operating system combining a powerful processing flow and provides simple operation instruction. Raised edges prevent Tenchen phone case from any scratches
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