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top brand semiconductor wire bonding gold wire for digital device

top brand semiconductor wire bonding gold wire for digital device
  • top brand semiconductor wire bonding gold wire for digital device
  • top brand semiconductor wire bonding gold wire for digital device

top brand semiconductor wire bonding gold wire for digital device

Rocket PCB Solution Ltd. has a team with rich production experience and strong production capacity, and learns from foreign advanced technology, equipped with the most advanced semiconductor wire bonding production equipment, which provides a strong guarantee for the excellent quality of semiconductor wire bonding.
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top brand semiconductor wire bonding gold wire for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Rocket PCB Solution Ltd. Pay attention to product quality, and strictly follow relevant standards in the process of product planning, design, manufacturing, testing, and transportation. The semiconductor wire bonding produced is not only stable in performance, high in safety, but also of excellent quality and high quality .
After years of industry exploration, Rocket PCB Solution Ltd. has not only accumulated rich production experience, but also mastered advanced production technology, which can realize semiconductor wire bonding good and fast production, and all semiconductor wire bonding have undergone strict quality inspections and meet national standards Quality inspection standards, quality is trustworthy.
Rocket PCB Solution Ltd.The production strength is strong, the management system is perfect, and the semiconductor wire bonding produced are all selected high-quality materials, which are manufactured by advanced technology and fine processing, with excellent workmanship and high quality, which are both beautiful and practical.
The company has strong strength and strict management. It not only has a standardized production workshop, but also has established a perfect quality management system. From the selection of raw materials to the delivery of finished products, the quality is strictly controlled in every link to ensure the excellent quality of semiconductor wire bonding.
Rocket PCB Solution Ltd. has many years of production experience, exquisite production technology, strong production strength, and can produce high-quality semiconductor wire bonding.
This product can effectively resist stains. The surface sealer has been applied to allow it not to be affected by some acidic liquids like vinegar, red wine, and lemon juice.
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