top brand semiconductor wire bonding gold wire for digital device

methods

Common PCB plating and wire bonding methods include

◪ Aluminum Wedge Wire Bonding and ENIG Plating

◪ Gold Ball Wire Bonding and soft gold plating

◪ Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Product application

Consumer electronics

Automotive electronics

Communications

Energy

Industrial & Instrumentation

IOT/Smart Home

Medical electronics

Security Industry

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Rocket PCB semiconductor wire bonding is professionally designed. It is created by our designers who master the elements and principles of design, color theory, basic garment silhouettes, as well as garment styling & details. Improving the quality of products and wining the market are our ultimate goal

m******s

Rocket PCB semiconductor wire bonding has a better design. It goes through mock-up construction. And the design is ameliorated based on the test performance of the field mock-up. Hanway has 180T,280T,400T,500T,1000T die casting machine

h******i

Many factors have been considered during the development of Rocket PCB semiconductor wire bonding. From the shielding case, conductor, arrangement of circuits, PCB design, to even the size of the heat sink are all carefully thought over and experimented by the technicians. Improving the quality of products and wining the market are our ultimate goal

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The production of Rocket PCB semiconductor wire bonding involves the following major steps. It has to go through stamping, coating, painting, drying, and polishing by respective machines.

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Rocket PCB semiconductor wire bonding has passed the tests required in the industry. They include a hipot test, leakage current test, insulation resistance test, etc. Our products have good performance like waterproof which ensures the lifespan of the products

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Rocket PCB Solution Ltd. There are stable raw material suppliers, stable supply of raw materials and low procurement costs, coupled with high degree of automation of production equipment, low consumption of energy, materials, and manpower in the production and processing process, and the final semiconductor wire bonding produced is excellent in overall cost performance.

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ABOUT US

CONTACT US

Office: (+86) 755 23040566

Tel: (+86) 158 9965 5195

E-mail: sales@rocket-pcb.com

Skype: Hans@Rocket-PCB

Whatsapp: 86 1589965 5195

Office Address: 2207,Bid 4,He Gu Shan Hui Cheng,35#,Guang Tian RoYanluo street, Song Gang Town,518105 SHENZHENG, CHINA

Plant ADD.: No 69, Lianfeng North Road, Xianxi Area, ChangAn Town, Dongguan, China.

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