loading
Rocket PCB  >  AI - Page Sitemap  >  top brand semiconductor wire bonding gold wire for digital device
top brand semiconductor wire bonding gold wire for digital device

top brand semiconductor wire bonding gold wire for digital device
  • top brand semiconductor wire bonding gold wire for digital device
  • top brand semiconductor wire bonding gold wire for digital device

top brand semiconductor wire bonding gold wire for digital device

semiconductor wire bonding bears the signature of exquisite craftsmanship. Through hardening treatment, it is sturdy enough
Inquire Online
Get the latest price
Quantity Needed:
Pieces
E-mail:

methods


top brand semiconductor wire bonding gold wire for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


top brand semiconductor wire bonding gold wire for digital device-2                
Consumer electronics
top brand semiconductor wire bonding gold wire for digital device-3                
Automotive electronics
top brand semiconductor wire bonding gold wire for digital device-4                
Communications
top brand semiconductor wire bonding gold wire for digital device-5                
Energy
top brand semiconductor wire bonding gold wire for digital device-6                
Industrial & Instrumentation
top brand semiconductor wire bonding gold wire for digital device-7                
IOT/Smart Home
top brand semiconductor wire bonding gold wire for digital device-8                
Medical electronics
top brand semiconductor wire bonding gold wire for digital device-9                
Security Industry

Such structures of semiconductor wire bonding are characterized by semiconductor wire bonding.
semiconductor wire bonding's material is controlled to be just right. It is widely used by Apple, IKEA, and other famous companies
semiconductor wire bonding material assures superior performance of semiconductor wire bonding. It has been granted with CE, RoHS, TUV and other certifications
The major factors that affect semiconductor wire bonding quality is optimized using semiconductor wire bonding technological measures. The product has a high-hardness surface
Rocket PCB Solution Ltd. adopts advanced production technology during the process of manufacturing semiconductor wire bonding. The product has the advantage of high strength
This product has received international recognition for its performance and quality. It is popular for its good heat-insulated performance
Product Message
Chat Online
Chat Online
Leave Your Message inputting...
Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, and we will reply to you ASAP. Welcome, what can I help you?
Sign in with: