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top brand semiconductor wire bonding gold wire for digital device

top brand semiconductor wire bonding gold wire for digital device
  • top brand semiconductor wire bonding gold wire for digital device
  • top brand semiconductor wire bonding gold wire for digital device

top brand semiconductor wire bonding gold wire for digital device

The production process of Rocket PCB semiconductor wire bonding is documented to guarantee consistent and accurate production. It is very easy to install and use
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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Rocket PCB semiconductor wire bonding is designed using the latest design concept and manufactured from quality raw materials sourced from reliable suppliers. The heavy-duty materials with precision engineering can ensure its durability for long service time
Rocket PCB semiconductor wire bonding differentiates itself over the competition by using well-selected materials and lean production method. The product is convenient to fix and hard to shift
Monitored production process: the production process of Rocket PCB semiconductor wire bonding is strictly and constantly monitored. A 24 hours shift system is carried out to ensure high-efficiency production. It is characterized by oxidation resistance and not easy to get rusty
Premium raw materials: Rocket PCB semiconductor wire bonding is made of high-quality materials which undergo strict screening before entering the factory. These materials are proven to be of high quality regarding production. The center of the product is highly consistent
The production process of Rocket PCB semiconductor wire bonding follows an advanced technology. Made of strong materials, it is high-strength
This product has a clean surface. Its sheets have gone through surface preparation with sandblasting and priming to remove rust, dirt, contaminants, etc. It is made to provide easy additional security for years to come
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