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top brand semiconductor wire bonding gold wire for digital device

top brand semiconductor wire bonding gold wire for digital device
  • top brand semiconductor wire bonding gold wire for digital device
  • top brand semiconductor wire bonding gold wire for digital device

top brand semiconductor wire bonding gold wire for digital device

In the creation of Rocket PCB [拓展关键词, the CAD software program is adopted. This software can provide a view of the piece of jewelry from all types of angles, including the inside, from the top, or the sides.
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top brand semiconductor wire bonding gold wire for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

The inspection of Rocket PCB semiconductor wire bonding adopts automatic machines. The inspection includes the dimension of ID, OD, and width as well as the defects on appearance.
Rocket PCB semiconductor wire bonding is professionally designed. It is carried out by our designers who strive to achieve economical and efficient water treatment effect.
Regarding the appearance treatment, Rocket PCB semiconductor wire bonding meets the domestic quality standards for porcelain. There are no more than two flaws including glaze peels, crack, dark spot, and bubble.
The production of Rocket PCB semiconductor wire bonding involves a wide range of procedures, ranging from metallic elements preparation, electrode coating, cell Assembly, formation and process control.
During the production of Rocket PCB semiconductor wire bonding, advanced manufacturing equipment are introduced such as cleaning, engraving, and packing machines which are specifically designed for gift or crafts making.
The product features the desired reliability. It does not tend to shutdown due to emergencies such as instantaneous change of current or sudden power cut.
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