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top brand semiconductor wire bonding gold wire for digital device

top brand semiconductor wire bonding gold wire for digital device
  • top brand semiconductor wire bonding gold wire for digital device
  • top brand semiconductor wire bonding gold wire for digital device

top brand semiconductor wire bonding gold wire for digital device

Reliable raw materials: the raw materials of Rocket PCB semiconductor wire bonding are all sourced from the suppliers who have established long term reliable cooperation with us. Their products are all certified. There is no residual glue after stripped off
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methods


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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Fine workmanship: Rocket PCB semiconductor wire bonding is crafted by skillful and experienced workers who aim at producing high quality products and use their skills to perfect the product. It has been widely exported to Taiwan, the USA, Europe, Southeast Asia, and the Middle East
Proper materials: semiconductor wire bonding is made of materials with properties that not only meet the performance or reliability requirement but also is easy to work with during production. Pattern printing can be customized on this product
Produced by the combination of sophisticated technology and skilled worker, Rocket PCB semiconductor wire bonding is exquisite in every detail. It has been widely exported to Taiwan, the USA, Europe, Southeast Asia, and the Middle East
Rocket PCB semiconductor wire bonding designed and manufactured using the finest quality raw materials and the latest technology in accordance with the industry norms and standards. The product provides protection against light, heat, and oxygen
By reforming the technology of manufacturing, Rocket PCB semiconductor wire bonding has finer workmanship. It has the advantage of good breaking strength
Our semiconductor wire bonding not only has excellent quality, but also has an affordable price, and the overall cost performance is relatively high.
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