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top brand semiconductor wire bonding finished bulk fabrication for automotive

top brand semiconductor wire bonding finished bulk fabrication for automotive
  • top brand semiconductor wire bonding finished bulk fabrication for automotive
  • top brand semiconductor wire bonding finished bulk fabrication for automotive

top brand semiconductor wire bonding finished bulk fabrication for automotive

It is the experienced design team that our semiconductor wire bonding are ingenious.
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top brand semiconductor wire bonding finished bulk fabrication for automotive-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


top brand semiconductor wire bonding finished bulk fabrication for automotive-2                
Consumer electronics
top brand semiconductor wire bonding finished bulk fabrication for automotive-3                
Automotive electronics
top brand semiconductor wire bonding finished bulk fabrication for automotive-4                
Communications
top brand semiconductor wire bonding finished bulk fabrication for automotive-5                
Energy
top brand semiconductor wire bonding finished bulk fabrication for automotive-6                
Industrial & Instrumentation
top brand semiconductor wire bonding finished bulk fabrication for automotive-7                
IOT/Smart Home
top brand semiconductor wire bonding finished bulk fabrication for automotive-8                
Medical electronics
top brand semiconductor wire bonding finished bulk fabrication for automotive-9                
Security Industry

Rocket PCB semiconductor wire bonding stands out from others for its practical and aesthetic design.
Rocket PCB semiconductor wire bonding has audacious and unique design style.
Our professional team enables semiconductor wire bonding to be more popular in its semiconductor wire bonding.
Motivated by different styles of design, our designers have successfully worked out fashionable semiconductor wire bonding.
Rocket PCB semiconductor wire bonding has a wide selection of high-quality materials.
Every aspect of the product is excellent, including performance, durability, and practicality.
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