Rocket PCB  >  AI - Page Sitemap  >  top brand semiconductor wire bonding finished bulk fabrication for automotive
top brand semiconductor wire bonding finished bulk fabrication for automotive

top brand semiconductor wire bonding finished bulk fabrication for automotive
  • top brand semiconductor wire bonding finished bulk fabrication for automotive
  • top brand semiconductor wire bonding finished bulk fabrication for automotive

top brand semiconductor wire bonding finished bulk fabrication for automotive

Rocket PCB semiconductor wire bonding has been strictly tested. The testing involves metals precipitation, oil and grease removal, and BOD or COD removal. The product is best known for offering warmth for the feet
Inquire Online
Get the latest price
Quantity Needed:
Pieces
E-mail:

methods

top brand semiconductor wire bonding finished bulk fabrication for automotive-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


top brand semiconductor wire bonding finished bulk fabrication for automotive-2                
Consumer electronics
top brand semiconductor wire bonding finished bulk fabrication for automotive-3                
Automotive electronics
top brand semiconductor wire bonding finished bulk fabrication for automotive-4                
Communications
top brand semiconductor wire bonding finished bulk fabrication for automotive-5                
Energy
top brand semiconductor wire bonding finished bulk fabrication for automotive-6                
Industrial & Instrumentation
top brand semiconductor wire bonding finished bulk fabrication for automotive-7                
IOT/Smart Home
top brand semiconductor wire bonding finished bulk fabrication for automotive-8                
Medical electronics
top brand semiconductor wire bonding finished bulk fabrication for automotive-9                
Security Industry

In the design of Rocket PCB semiconductor wire bonding, our experienced designers utilize the concepts of clean lines that don't make the bathroom look cluttered. The product is naturally thermostatic, offering warmth in winter and coolness in summer
Rocket PCB semiconductor wire bonding undergoes various production stages. These stages include pattern cutting, sections stitching, taking its shape, attaching the soles, and assembling. The product is highly resistant to water
Rocket PCB semiconductor wire bonding is developed containing special Electro-Magnetic Interference Suppression Components. These components help reduce or eliminate noise caused by electromagnetism. The product is designed based on the ergonomics and the foot structure
Rocket PCB semiconductor wire bonding has to go through sophisticated production processes. These processes include cutting, mechanical processing, stamping, welding, polishing, and surface treatment. The product contributes to the health of the feet
Rocket PCB semiconductor wire bonding is rigorously tested. It has passed many tests: antibacterial & antimicrobial testing, slip resistance testing, shedding propensity testing, and stitching reinforcement strength testing. It's less likely to restrain movement and cause joint injury
This product has many features. Compared with similar products, the luster is better, and the feel is more comfortable and soft. The product keeps the feet dry and protects feet from moisture and frostbite
Product Message
Chat Online 编辑模式下无法使用
Chat Online inputting...
Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!