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top brand semiconductor wire bonding fabrication wire for digital device

top brand semiconductor wire bonding fabrication wire for digital device
  • top brand semiconductor wire bonding fabrication wire for digital device
  • top brand semiconductor wire bonding fabrication wire for digital device

top brand semiconductor wire bonding fabrication wire for digital device

The design of Rocket PCB semiconductor wire bonding is never out of date. We are committed to improving our core value to be more competitive in the market
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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Raw materials of semiconductor wire bonding meet the EU safety and environmental protection standards. Complete OEM service in Hanway is guaranteed to satisfy customers
Our semiconductor wire bonding products cater to different styles of dinning occasions. Hanway has been specialized in aluminum, zinc and brass die casting for over 13 years
Rocket PCB semiconductor wire bonding is added the latest design concepts. Our mission is to provide solutions for high quality casting products with our professional team and advanced technology
The material waste of Rocket PCB semiconductor wire bonding is reduced during production. Our staff will promptly give our response to customers
Rocket PCB Solution Ltd. continuously works to rejuvenate and expand its capabilities by developing new semiconductor wire bonding products. We provide tooling design,tooling fabrication, die casting, secondary process, precision machining,T6 treatment,finish treatment and assembling
semiconductor wire bonding Excellent material selection, exquisite workmanship, stable performance, high quality, excellent quality, strong and durable, with excellent properties such as high temperature resistance, compression resistance, aging resistance, and corrosion resistance.
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