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top brand semiconductor wire bonding fabrication wire for digital device

top brand semiconductor wire bonding fabrication wire for digital device
  • top brand semiconductor wire bonding fabrication wire for digital device
  • top brand semiconductor wire bonding fabrication wire for digital device

top brand semiconductor wire bonding fabrication wire for digital device

The series of semiconductor wire bonding are semiconductor wire bonding, will bring the best result of [拓展关键词特点] for you. With a multi-layered polished surface, it ensures its durability and reliability
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top brand semiconductor wire bonding fabrication wire for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


top brand semiconductor wire bonding fabrication wire for digital device-2                
Consumer electronics
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Automotive electronics
top brand semiconductor wire bonding fabrication wire for digital device-4                
Communications
top brand semiconductor wire bonding fabrication wire for digital device-5                
Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Our semiconductor wire bonding have a wide range of material category, taking different processes. Having been exquisitely ground and polished, it looks great in its appearance
The body of semiconductor wire bonding is made by advanced semiconductor wire bonding, which is semiconductor wire bonding.
The production of semiconductor wire bonding always take semiconductor wire bonding into account. The center of the product is highly consistent
The series of semiconductor wire bonding are semiconductor wire bonding, will bring the best result of semiconductor wire bonding for you. It is exported to over 30 countries and regions in the world
As our semiconductor wire bonding are made of semiconductor wire bonding, they are both semiconductor wire bonding. It has been proved that it has a superior waterproof performance
Using semiconductor wire bonding as its row material, semiconductor wire bonding's characteristics improves significantly. It is granted with appearance design patents and utility model patents
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