Rocket PCB stagger any-layer pcb free sample for wholesale

Company Advantages
1. any-layer pcb is very competitive simply because its reasonable structure and pcb prototyping .
2. We have a complete set of quality assurance system and sophisticated testing equipment to ensure its quality.
3. An appropriate programmed of quality control (qc) must be implemented in its production.
4. The product, available in a rather competitive price, is widely used in the market.

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

ROCKET PCB Any Layer PCB （ELIC）process flow

Anylayer PCB DFM suggestion for layout

The technology of making any layer HDI is summarized as follows

1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.

 

With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.

Company Features
1. Rocket PCB has powerful brand recognition, social influence and wide recognition in the any-layer pcb field.
2. A strong technical base is the key to Rocket PCB Solution Ltd. significantly improving the quality and performance of double layer pcb .
3. Rocket PCB Solution Ltd. has been endeavoring to ensure the quality of the service. Contact! The goal of our company is to become a leading pcb prototyping exporter at home and abroad. Contact! Rocket PCB hopes to become an highly influential enterprise to produce pcb manufacturing process. Contact!