High multilayer anylayer HDI PCB stacked and stagged mircovias

Product Information

Application Scope

Rocket PCB's HDI PCB is widely used in the Manufacturing Electrical Equipment & Supplies PCB & PCBA industry.Rocket PCB insists on providing customers with reasonable solutions according to their actual needs.

Enterprise Strength

Rocket PCB always puts customers and services in the first place. We constantly improve service while paying attention to product quality. Our goal is to provide high-quality products as well as thoughtful and professional services.

Company Advantages
1. Rocket PCB pcb prototyping fully complies with the relevant product safety Standard that governs it. It goes through a robust program of product testing, factory inspection, and on-going product surveillance to ensure safety.
2. The product features significant water absorption. It can absorb the amount of water under specified conditions such as temperatures and length of exposure.
3. This product is widely used by people from all walks of life.
4. The product is currently well-received in the market and is applied by more and more people.

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......

ROCKET PCB Any Layer PCB （ELIC）process flow

Anylayer PCB DFM suggestion for layout

Product FEATURES

◪ Any Layer PCBs with laser vias and filled plating on each layer

◪ 0.4mm thin spacing CSP supported by Any layer interconnection

◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

SPECIALIZED MANUFACTURING

Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

CAPABILITIES

3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias

EXTENSIVE ANALYTICAL TESTING

Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing

FEATURES

PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias

Product application

Consumer electronics

Automotive electronics

Communications

Energy

Industrial & Instrumentation

IOT/Smart Home

Medical electronics

Security Industry

Company Features
1. For several decades, Rocket PCB Solution Ltd. has been engaged in the pcb manufacturing processindustry, and it has grown quickly.
2. Facing the future, Rocket PCB is committed to using the leading technology to offer the best any-layer pcb .
3. Rocket PCB Solution Ltd. will focus on the needs of each customer. Please contact. The vision and mission of our company are clear and concise. We have a plan to be a leading company in this industry within several years, and we hope our employees will help us achieve the goals and objectives through their contribution. Please contact. In the long run, Rocket PCB Solution will always create value for business partners. Please contact.

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Rocket PCB customized pcb manufacturing process precision

Product FEATURES

EXTENSIVE ANALYTICAL TESTING

Product application