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printed circuit board manufacturing board auto Rocket PCB

printed circuit board manufacturing board auto Rocket PCB

Printed circuit board manufacturing board auto Rocket PCB

Name:
Backplane PCB, high speed backplane
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
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Quantity Needed:
Pieces
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Product Details
Rocket PCB's HDI PCB is exquisite in details.Rocket PCB adopts eco-friendly, safe and solid material to manufacture printed circuit board. The finished product is safe, reliable, durable and affordable, which is recognized by the majority of customers.Rocket PCB carries out strict quality monitoring and cost control on each production link of HDI PCB, from raw material purchase, production and processing and finished product delivery to packaging and transportation. This effectively ensures the product has better quality and more favorable price than other products in the industry.
Enterprise Strength
  • Rocket PCB has experienced technicians and excellent R&D personnel to develop products. As for the market, our professional sales staff and service personnel would provide you with quality products and services.
  • Rocket PCB ensures that consumers' legal rights can be protected effectively by establishing a comprehensive customer service system. We are dedicated to providing consumers with services including information consultation, product delivery, product return, and replacement and so on.
  • Business philosophy: Quality excellence, fine products, sci-tech innovations
  • Enterprise mission: Build a first-class brand and promote industry development
  • Enterprise spirit: Aggressive, mutually-beneficial, win-win
  • After years of development, Rocket PCB summarized a complete advanced production method for electric equipment, which is widely accepted in the industry. We have greatly improved our industry influence.
  • Rocket PCB's sales network spans many regions at home and abroad.
Company Advantages
1. The design of high speed backplane focuses on printed circuit board manufacturing .
2. high speed backplane can effectively printed circuit board manufacturing and increasing the operating quality.
3. This product has won the good reputation and trust of domestic and foreign customers.

PCB Backplane Technology

The backplane has always been a specialized product in the PCB manufacturing industry, the backplane is thicker and heavier than the conventional PCB board, and its heat capacity is larger accordingly.

In view of the slow cooling speed of the backplane, the length of the reflow weld furnace should be lengthened. There is also a need for forced air cooling at the outlet to reduce the backplane temperature to a safe operating level.


The user's need for thinner cores and more layers of backplane comes to the opposite requirements of the conveyor system. When a large power application card is plugged into the backplane, the copper layer thickness must be moderate to provide the required current,all of these factors lead to an increase in the average weight of the backplane. This requires that conveyor belts and other conveyor systems must not only be able to safely transfer large-size raw material backplanes, and it must also be taken the weight increment into account.


Because the backplane is thicker than the conventional PCB, and the number of holes is much more, it is easy to cause the outflow phenomenon of processing fluid. In order to minimize the amount of liquid carrying and remove the possibility of any impurities remaining at the through hole, it is very important to clean the hole by means of high-pressure flushing and air blower.


Interlayer alignment become important due to the increasing number of layers required by user applications. Interlayer-to-bit requirements tolerance convergence, larger backplane size makes this convergence more demanding.


All pattern processes are produced in a controlled environment of a certain temperature and humidity. The alignment tolerance of the entire area before and after the graph should be maintained at 0.0125mm. CCD camera needs to be used to complete the front and rear layout of the position. After etching, use four drilling system to perforated the inner laminates. Perforated through the core board, position accuracy maintained at 0.025mm, the repeatable capacity of 0.0125mm, then insert the perforation with the pin, align the etched inner layer, At the same time glue the inner layer together. The use of this etched perforation method can fully ensure that the hole and etching copper plate alignment, forming a solid ring design structure. However, with the user in the PCB wiring requirements more detailed, in order to keep the board cost unchanged, the etching copper plate size is required to be smaller, thus requiring better alignment of the interlayer copper plate. Fixture and conveyor equipment must be able to transmit large plates and heavy plates simultaneously.


In addition to drilling requirements, backplane designers generally have different requirements for copper uniformity on the surface of the outer layer Some designs etch very few signal lines on the outer layer. On the other hand, in the face of high-speed data rate and impedance control line requirements, the external layer set solid copper sheet will become very necessary for the use of EMC shielding layer

Etching line widths, thicknesses, and tolerances become key indicators for the effectiveness and repeatable control of the backplane impedance. At this point, the AOI method can be used to ensure that the etched copper pattern matches the design data. The impedance model is used to determine and control the sensitivity of the impedance to the line width change by setting the line width tolerance on the AOI.


Traditionally, for reliability reasons, there is a tendency to use passive components on the Backplane. However, in order to maintain the fixed cost of active plate, BGA and other active devices are more and more designed on the Backplane, component mounting equipment must not only be able to place smaller specifications of capacitors and resistors but also be able to operate on additional silicon packaging components. In addition, the Backplane large specification requires the installation of equipment bed to be large, and the heavy backplane can also be shifted with fine position tolerances.




Product FEATURES


High-speed Backplanes:

  ◪   Panel sizes up to 54 inches

  ◪   Over 70 layers

  ◪   Blind and back drilled through holes

  ◪   Dual diameter holes

  ◪   Heavy copper layers

  ◪   Connector expertise



Product application


               
Consumer electronics
               
Automotive electronics
               
Communications
               
Energy
               
Industrial & Instrumentation
               
IOT/Smart Home
               
Medical electronics
               
Security Industry

Company Features
1. Rocket PCB Solution Ltd. is among the most professional supplier for high speed backplane in China.
2. Rocket PCB Solution Ltd. has formed a professional pcb technologies development teams.
3. Rocket PCB abides by the tenet of quality first, customers foremost to strive forward for our growth. Get more info! The establishment of standards for Backplane PCB will make Rocket PCB Solution Ltd. truly serve the customers. Get more info!
Favorable rate
100%
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!