A lot of laminte suppliers are already signaling July adjustments.

• Resin costs are still not stable

• Glass fiber fabric is tight on some high-Tg grades

• High-speed / high-frequency materials are more selective on availability

It's not a "big jump overnight" situation, but more like:

quotes valid period getting shorter, pricing flexibility shrinking

Copper hasn't been dramatic, but it's staying firm.

What we're seeing in the chain:

• Copper price stays at a relatively high level

• Some copper foil specs (especially ultra-thin / HVLP) are harder to secure

• Lead time for certain high-end foils is slightly longer than last month

This is quietly affecting:

• HDI builds

• High-speed digital boards

• AI server related designs

One thing is clear:

• AI server projects are still pushing hard

• Higher layer count boards are becoming normal, not “special” anymore

• More designs are moving toward HDI + high-speed materials

So instead of overall growth, what we see is:

capacity getting concentrated at the high end

That usually means pricng power moves there first.

Right now the industry is basically in this phase:

• Materials slowly rising

• High-end capacity getting tighter

• Standard projects still competitive, but less room on margin

So pricing is not "going up everywhere" -- it's more like a split between commodity and high-end PCB is becoming clearer again.

We're not trying to "fight the market", but to work with it in a practical way.

1. Material flexibility (real, not marketing talk)

We regularly work with:

• Shengyi / ITEQ / Rogers / Isola systems

• Different cost-performance combinations depending on application

So when one material goes tight, we can usually shift options instead of delaying the whole project.

2. Multi-factory coordination

Because we work with multiple PCB manufacturing partners in China:

• HDI capacity can be allocated more flexibly

• High-layer / high-speed / thick copper boards have backup routing

• Less dependency on a single factory bottleneck

This becomes very important when lead times start stretching in the market.

3. Engineering-first quoting

Before final pricing, we usually look at:

• stack-up optimization

• via structure simplification (when possible)

• material alternatives for same performance target

Not to “cut corners”, but to avoid unnecessary cost spikes during a rising market.

Final thought

End of June feels less like a “news event” and more like a quiet reset:

the PCB market is slowly moving into another cost-up cycle, especially at the material + high-end capacity side.

Not explosive, but persistent.

And in this kind of environment, execution matters more than price sheets.