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hot-sale wire bonding technology surface bulk fabrication for digital device

hot-sale wire bonding technology surface bulk fabrication for digital device
  • hot-sale wire bonding technology surface bulk fabrication for digital device
  • hot-sale wire bonding technology surface bulk fabrication for digital device
  • hot-sale wire bonding technology surface bulk fabrication for digital device

hot-sale wire bonding technology surface bulk fabrication for digital device

Over the years, Rocket PCB Solution Ltd., primarily focusing on the manufacturing of wire bonding services , has evolved to take a leading position in this industry in China.
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With the pursuit of perfection, Rocket PCB exerts ourselves for well-organized production and high-quality PCB prototyping.Rocket PCB has professional production workshops and great production technology. PCB prototyping we produce, in line with the national quality inspection standards, has reasonable structure, stable performance, good safety, and high reliability. It is also available in a wide range of types and specifications. Customers' diverse needs can be fully fulfilled.
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Enterprise Strength
  • It is still a long way to go for Rocket PCB to develop. Our own brand image is related to whether we are capable of providing customers with quality services. Thus, we proactively integrate advanced service concept in the industry and our own advantages, so as to provide diverse services covering from pre-sales to sales and after-sales. In this way can we meet consumers' different needs.
Company Advantages
1. The performance of Rocket PCB wire bonding services has been improved by our professional R&D team who try to deliver long-life performance at extended temperature ranges.
2. This product features good heat resistance. Adopting new composite materials, it can be sterilized at high temperatures without deformation.
3. The product is resistant to water. The alumina or resin sulfide system with low water absorption filler have been adopted, such as barium sulfate, and clay.
4. This product can absorb shock from walking or running and brings comfort or arch support, featuring excellent cushioning.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

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methods


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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



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Product application


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Consumer electronics
hot-sale wire bonding technology surface bulk fabrication for digital device-5                
Automotive electronics
hot-sale wire bonding technology surface bulk fabrication for digital device-6                
Communications
hot-sale wire bonding technology surface bulk fabrication for digital device-7                
Energy
hot-sale wire bonding technology surface bulk fabrication for digital device-8                
Industrial & Instrumentation
hot-sale wire bonding technology surface bulk fabrication for digital device-9                
IOT/Smart Home
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Medical electronics
hot-sale wire bonding technology surface bulk fabrication for digital device-11                
Security Industry

Company Features
1. Over the years, Rocket PCB Solution Ltd., primarily focusing on the manufacturing of wire bonding services , has evolved to take a leading position in this industry in China.
2. By emphasizing the importance of technological innovation, Rocket PCB will become an irreplaceable enterprise in the wire bonding technology industry.
3. To serve customers wholeheartedly is an unremarkable responsibility of Rocket PCB. Ask online! Rocket PCB Solution Ltd. firmly assures that quality is far more important than quantity. Ask online!
wire bonding services is manufactured based on the one-shot process. It is thick and fine in texture as well as attractive and exquisite in appearance. It is solid and use-durable.
wire bonding technology uses high-quality kaolin as raw materials. It is carefully made based on multiple complex procedures. It is a beautiful and functional product with thick texture and bright glazed layer.
wire bonding services is a high-quality, beautiful, and functional product with bright porcelain, smooth line, and delicate surface.
wire bonding services is made of high-quality materials and is baked at a high temperature. It has thick texture and smooth and bright glazed layer. It also feels fine. It is solid and durable.
wire bonding services is manufactured based on multiple procedures including traditional shape forming methods, high-temperature pyrograph, and glazed coloring. It has fine texture, smooth line, and attractive pattern. The extraordinary workmanship and quality excellence are reflected in details.
Our wire bonding services has edges in simple structure, wire bonding services, easy maintenance and high efficiency. The product is easy to replace and saves money an time
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!