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hot-sale wire bonding technology surface bulk fabrication for digital device

hot-sale wire bonding technology surface bulk fabrication for digital device
  • hot-sale wire bonding technology surface bulk fabrication for digital device
  • hot-sale wire bonding technology surface bulk fabrication for digital device
  • hot-sale wire bonding technology surface bulk fabrication for digital device

hot-sale wire bonding technology surface bulk fabrication for digital device

Over the years, Rocket PCB Solution Ltd., primarily focusing on the manufacturing of wire bonding services , has evolved to take a leading position in this industry in China.
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Product Details
With the pursuit of perfection, Rocket PCB exerts ourselves for well-organized production and high-quality PCB prototyping.Rocket PCB has professional production workshops and great production technology. PCB prototyping we produce, in line with the national quality inspection standards, has reasonable structure, stable performance, good safety, and high reliability. It is also available in a wide range of types and specifications. Customers' diverse needs can be fully fulfilled.
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Enterprise Strength
  • It is still a long way to go for Rocket PCB to develop. Our own brand image is related to whether we are capable of providing customers with quality services. Thus, we proactively integrate advanced service concept in the industry and our own advantages, so as to provide diverse services covering from pre-sales to sales and after-sales. In this way can we meet consumers' different needs.
Company Advantages
1. The performance of Rocket PCB wire bonding services has been improved by our professional R&D team who try to deliver long-life performance at extended temperature ranges.
2. This product features good heat resistance. Adopting new composite materials, it can be sterilized at high temperatures without deformation.
3. The product is resistant to water. The alumina or resin sulfide system with low water absorption filler have been adopted, such as barium sulfate, and clay.
4. This product can absorb shock from walking or running and brings comfort or arch support, featuring excellent cushioning.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

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methods


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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



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Product application


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Consumer electronics
hot-sale wire bonding technology surface bulk fabrication for digital device-5                
Automotive electronics
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Communications
hot-sale wire bonding technology surface bulk fabrication for digital device-7                
Energy
hot-sale wire bonding technology surface bulk fabrication for digital device-8                
Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Over the years, Rocket PCB Solution Ltd., primarily focusing on the manufacturing of wire bonding services , has evolved to take a leading position in this industry in China.
2. By emphasizing the importance of technological innovation, Rocket PCB will become an irreplaceable enterprise in the wire bonding technology industry.
3. To serve customers wholeheartedly is an unremarkable responsibility of Rocket PCB. Ask online! Rocket PCB Solution Ltd. firmly assures that quality is far more important than quantity. Ask online!
Rocket PCB wire bonding technology is an up-to-date and practical design. It is designed in a simplistic style by the designers who are quite acquainted with market trends in the sanitary ware industry. It serves as a durable, modern, interactive billboard to convey any intended message in a powerful way
During the production of Rocket PCB wire bonding technology, its dimension and specification are strictly scrutinized to minimize the size inaccuracy measurement which will affect the sealing effect. The product has optional LED lighting to add interest and visibility
Rocket PCB wire bonding technology is composed of various electric components. It is constructed with heating components, PCB, power protector, automatic power-off protector, overpressure-low pressure protector, cable connector, etc. Manufactured from high-grade steel and acrylic, it is ideal for both semi-outdoor and indoor environment
Rocket PCB wire bonding technology has been tested for many times. It has been inspected in terms of acoustical effects, Noise Isolation Class (NIC), and Noise Reduction Coefficient (NRC). The product is designed for efficient and intuitive user experience, coupled with simple service access
The materials applied in Rocket PCB wire bonding services are guaranteed to has strong wear and tear performance as well as leakage tightness, to provide the best longevity for application. Manufactured from high-grade steel and acrylic, it is ideal for both semi-outdoor and indoor environment
Products under the supervision of professionals, through strict quality inspection, to ensure product quality. The product has optional LED lighting to add interest and visibility
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: hans.hu@rocket-pcb.com welcome to consult!