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hot-sale wire bonding process wire wire for digital device

hot-sale wire bonding process wire wire for digital device

Hot-sale wire bonding process wire wire for digital device

Name:
wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
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Quantity Needed:
Pieces
E-mail:
Application Scope
Rocket PCB's PCB prototyping is widely used in many industries.Since the establishment, Rocket PCB has always been focusing on the R&D and production of printed circuit board. With great production capability, we can provide customers with personalized solutions according to their needs.
Product Comparison
Rocket PCB has professional production workshops and great production technology. printed circuit board we produce, in line with the national quality inspection standards, has reasonable structure, stable performance, good safety, and high reliability. It is also available in a wide range of types and specifications. Customers' diverse needs can be fully fulfilled.Compared with other products in the same category, printed circuit board has outstanding advantages which are mainly reflected in the following points.
Company Advantages
1. The materials for Rocket PCB wire bonding process are carefully selected. The materials, controlled and inspected by QC team, must have high insulation level and anti-corrosive performance, especially the electric parts.
2. During the testing phase, its quality has been paid great attention by the QC team.
3. More than being aesthetically pleasing, this garment aligns with the fit expectation of the target customer in a consistent and reliable manner.

methods


hot-sale wire bonding process wire wire for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. is widely famous in creating beautiful wire bonding process .
2. Our factory has a reasonable layout. This advantage ensures the smooth flow of our raw materials and effectively maximizes the effectiveness of the production process.
3. The vision of Rocket PCB is to become a world-famous brand. Call now! The goal of Rocket PCB Solution Ltd. is to bolster the technical advantage and become an specialist in the area of wire bonding pcb . Call now!
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!