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hot-sale wire bonding process wire wire for digital device

hot-sale wire bonding process wire wire for digital device
  • hot-sale wire bonding process wire wire for digital device
  • hot-sale wire bonding process wire wire for digital device

hot-sale wire bonding process wire wire for digital device

Rocket PCB Solution Ltd. is widely famous in creating beautiful wire bonding process .
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Application Scope
Rocket PCB's PCB prototyping is widely used in many industries.Since the establishment, Rocket PCB has always been focusing on the R&D and production of printed circuit board. With great production capability, we can provide customers with personalized solutions according to their needs.
  • hot-sale wire bonding process wire wire for digital device-Rocket PCB-img
Product Comparison
Rocket PCB has professional production workshops and great production technology. printed circuit board we produce, in line with the national quality inspection standards, has reasonable structure, stable performance, good safety, and high reliability. It is also available in a wide range of types and specifications. Customers' diverse needs can be fully fulfilled.Compared with other products in the same category, printed circuit board has outstanding advantages which are mainly reflected in the following points.
  • hot-sale wire bonding process wire wire for digital device-PCB prototype-pcb fabrication-PCB maker-R
    hot-sale wire bonding process wire wire for digital device-pcb fabrication, PCB maker, PCB manufactu
Company Advantages
1. The materials for Rocket PCB wire bonding process are carefully selected. The materials, controlled and inspected by QC team, must have high insulation level and anti-corrosive performance, especially the electric parts.
2. During the testing phase, its quality has been paid great attention by the QC team.
3. More than being aesthetically pleasing, this garment aligns with the fit expectation of the target customer in a consistent and reliable manner.

methods


hot-sale wire bonding process wire wire for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
hot-sale wire bonding process wire wire for digital device-5                
Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. is widely famous in creating beautiful wire bonding process .
2. Our factory has a reasonable layout. This advantage ensures the smooth flow of our raw materials and effectively maximizes the effectiveness of the production process.
3. The vision of Rocket PCB is to become a world-famous brand. Call now! The goal of Rocket PCB Solution Ltd. is to bolster the technical advantage and become an specialist in the area of wire bonding pcb . Call now!
aluminum wire bonding process It is made of green and environmentally friendly materials and manufactured with fine processing technology. It is safe and environmentally friendly, durable, and you can buy it with confidence.
wire bonding pcbThe materials are carefully selected, the materials are thick, the craftsmanship is exquisite, the workmanship is fine, the quality is stable, the quality is high, and it is both beautiful and practical. Compared with other similar products, it is more competitive in the market.
wire bonding process Equipped with a super-large display screen, professional audio and game controller, the picture is clear, the sound quality is outstanding, the motion control is precise and delicate, and the 360-degree three-dimensional immersive experience brings you unexpected shocking effects.
wire bonding process is a children's play equipment that integrates amusement, sports, intelligence, fitness and other functions. It is designed for children who like drilling, climbing, sliding, swinging, jumping, shaking, etc., and can exercise children's guts very well. and courage.
wire bonding process The overall structure is reasonable in design, sensitive in response, safe in use, simple in operation, convenient for installation and maintenance, durable and long in service life.
The product is corrosion resistant. It is hardly affected by liquids such as acid-alkaline chemicals, oil, and bath cream. It will not cause any infection and microbial contamination
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