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hot-sale wire bonding process wire bulk fabrication for electronics

hot-sale wire bonding process wire bulk fabrication for electronics
  • hot-sale wire bonding process wire bulk fabrication for electronics
  • hot-sale wire bonding process wire bulk fabrication for electronics

hot-sale wire bonding process wire bulk fabrication for electronics

Over the years, Rocket PCB Solution Ltd. has been leading the industry trends with professionalism in developing and manufacturing wire bonding process .
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Enterprise Strength
  • Rocket PCB will deeply understand the needs of users and offer great services to them.
Application Scope
Rocket PCB's PCB maker is widely used in the Manufacturing Electrical Equipment & Supplies PCB & PCBA industry.With a focus on customers, Rocket PCB analyzes problems from the perspective of customers and provides comprehensive, professional and excellent solutions.
Company Advantages
1. aluminum wire bonding process materials has improved the physical properties of wire bonding process .
2. wire bonding process has many characteristics like aluminum wire bonding process .
3. wire bonding process is extensively used in china now, because of aluminum wire bonding process .
4. Rocket PCB Solution Ltd. ensures efficient quality service for the clients.

methods


hot-sale wire bonding process wire bulk fabrication for electronics-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Over the years, Rocket PCB Solution Ltd. has been leading the industry trends with professionalism in developing and manufacturing wire bonding process .
2. Rocket PCB Solution Ltd. has a number of years of experience in the production of export wire bonding technology products.
3. The time is changing while Rocket PCB still will hold onto its mission to satisfy each customer. Get more info! Sticking to the corporate spirit of putting customers first, Rocket PCB will be encouraged to ensure the quality of the service. Get more info! For the better development of Rocket PCB, necessary enterprise culture will be more necessary. Get more info!
Rocket PCB aluminum wire bonding process delivers a stable performance with guaranteed quality. The product adopts the advanced RFID technology
The appealing appearance of Rocket PCB wire bonding process expresses a sense of beauty to customers. The product is eminent in its automatic resolution capability that prevents data interference between cards
The raw material used in Rocket PCB wire bonding technology is procured from some of the reliable vendors. The product is highly resistant to substances such as oil and chemicals
Rocket PCB wire bonding process is manufactured in compliance with the industry standards using premium raw materials. It can be applied widely including access control, transportation and shopping centers
Rocket PCB wire bonding process is manufactured using high-quality raw materials together with a mix of man and machine. The product is highly reliable without static breakdown problems
Our quality experts test this product on different parameters, so as to maintain the quality. It is noted for its strong sensitivity
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!