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hot-sale wire bonding process fabrication bulk fabrication for digital device

hot-sale wire bonding process fabrication bulk fabrication for digital device
  • hot-sale wire bonding process fabrication bulk fabrication for digital device
  • hot-sale wire bonding process fabrication bulk fabrication for digital device

hot-sale wire bonding process fabrication bulk fabrication for digital device

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Product Comparison
PCB prototyping is a truly cost-effective product. It is processed in strict accordance with relevant industry standards and is up to the national quality control standards. The quality is guaranteed and the price is really favorable.Rocket PCB's PCB prototyping has the following advantages over other similar products.
Company Advantages
1. The raw materials of Rocket PCB wire bonding process undergoes the strict selection, which is conducted by our workers.
2. It makes it easy for people to identify specific items. Because of its ability to distinguish the item with printing, people can always get easy access.
3. Its fabrics possess high antibacterial activity. They are able to inhibit the growth of many odor-causing bacteria and fungi.
4. Investing some money in buying this product is a one-time cost, but the benefits of the water purifying effect are continuous.

methods


hot-sale wire bonding process fabrication bulk fabrication for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
hot-sale wire bonding process fabrication bulk fabrication for digital device-4                
Communications
hot-sale wire bonding process fabrication bulk fabrication for digital device-5                
Energy
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Industrial & Instrumentation
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IOT/Smart Home
hot-sale wire bonding process fabrication bulk fabrication for digital device-8                
Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. has been focusing on developing and manufacturing semiconductor wire bonding since its establishment. We are a pioneer in this field.
2. We have a team of highly trained and educated professionals. They explore and push the boundaries of new technological frontiers that drive productivity, quality and cost savings.
3. wire bonding process is what we are committed to. Inquire! Rocket PCB survives with quality, seek for development with technology. Inquire!
semiconductor wire bonding is well designed to meet the market demand.
Such structures of wire bonding process are characterized by wire bonding process.
For semiconductor wire bonding, the service life of semiconductor wire bonding is more durable than that of others.
The major factors that affect wire bonding process quality is optimized using wire bonding process technological measures.
semiconductor wire bonding use wire bonding process design for better performance and long service life.
The product stands out for its stable operation. Since it is mainly controlled by microcomputers, it can run stably without any break.
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: hans.hu@rocket-pcb.com welcome to consult!