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hot-sale wire bonding process bonding bulk fabrication for automotive

hot-sale wire bonding process bonding bulk fabrication for automotive
  • hot-sale wire bonding process bonding bulk fabrication for automotive
  • hot-sale wire bonding process bonding bulk fabrication for automotive

hot-sale wire bonding process bonding bulk fabrication for automotive

Rocket PCB wire bonding process is manufactured by complying with the principle of "minimize the impacts on the environment". Its production process is in strict line with international standards of building materials. It can be customized with quartz, marble or solid surface sheet materials
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methods


hot-sale wire bonding process bonding bulk fabrication for automotive-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


hot-sale wire bonding process bonding bulk fabrication for automotive-2                
Consumer electronics
hot-sale wire bonding process bonding bulk fabrication for automotive-3                
Automotive electronics
hot-sale wire bonding process bonding bulk fabrication for automotive-4                
Communications
hot-sale wire bonding process bonding bulk fabrication for automotive-5                
Energy
hot-sale wire bonding process bonding bulk fabrication for automotive-6                
Industrial & Instrumentation
hot-sale wire bonding process bonding bulk fabrication for automotive-7                
IOT/Smart Home
hot-sale wire bonding process bonding bulk fabrication for automotive-8                
Medical electronics
hot-sale wire bonding process bonding bulk fabrication for automotive-9                
Security Industry

The raw material processing of Rocket PCB wire bonding process is finely controlled. The amounts of raw materials are calculated by the computer and the processing of raw materials are accurate. It performs well in high-temperature resistance
Through the entire process of Rocket PCB wire bonding process, our inspection team continuously tests and measures all steps and strictly respects the regulations of the beauty makeup industry. This product is not prone to scorching
Rocket PCB aluminum wire bonding process is developed by adopting the most advanced integrated circuits technology. The R&D team makes the transistor, resistor, capacitor, and other components gather together to achieve a compact design. It supports flexible cutting according to the socket holes and faucet holes
Rocket PCB aluminum wire bonding process is rigorously tested. It has passed many tests: antibacterial & antimicrobial testing, slip resistance testing, shedding propensity testing, and stitching reinforcement strength testing. Made of premium building material, its slab is sturdy and durable
The production process of Rocket PCB [|核心关键词] is rigorous, from the circuit boards that control the systems to the spray painting of the outside components.
This super soft product will be a new update that improve the sleep and work well with bedroom decorations. Processed by CNC cutting machine, it features excellent flatness
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