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hot-sale wire bonding process bonding bulk fabrication for automotive

hot-sale wire bonding process bonding bulk fabrication for automotive
  • hot-sale wire bonding process bonding bulk fabrication for automotive
  • hot-sale wire bonding process bonding bulk fabrication for automotive

hot-sale wire bonding process bonding bulk fabrication for automotive

The design of Rocket PCB wire bonding process is based on the human sensory. It is determined by a variety of thermal, physiological and mechanical parameters.
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hot-sale wire bonding process bonding bulk fabrication for automotive-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


hot-sale wire bonding process bonding bulk fabrication for automotive-2                
Consumer electronics
hot-sale wire bonding process bonding bulk fabrication for automotive-3                
Automotive electronics
hot-sale wire bonding process bonding bulk fabrication for automotive-4                
Communications
hot-sale wire bonding process bonding bulk fabrication for automotive-5                
Energy
hot-sale wire bonding process bonding bulk fabrication for automotive-6                
Industrial & Instrumentation
hot-sale wire bonding process bonding bulk fabrication for automotive-7                
IOT/Smart Home
hot-sale wire bonding process bonding bulk fabrication for automotive-8                
Medical electronics
hot-sale wire bonding process bonding bulk fabrication for automotive-9                
Security Industry

Rocket PCB aluminum wire bonding process is innovatively designed. It is designed by our designers who put emphasis on popular colors, patterns, sizes, and construction based on the latest apparel market trend.
Rocket PCB aluminum wire bonding process is produced following these stages: fabric sourcing, fabric relaxing, form layout, marking, cutting, sewing, checking, and spot cleaning and laundering.
During the production of Rocket PCB wire bonding process, fabric performance tests are conducted. These tests include fabric density, gram weight, fabric strength, shrinkage rate, tearing strength, etc.
The quality control for Rocket PCB wire bonding process is carried out meeting specified quality requirements. The product will be inspected in terms of sewing and stitching quality, appearance quality (pilling and fray), specification matching, etc.
Rocket PCB wire bonding process is manufactured at a high-quality level. It meets the standards stipulated in the National Basic Safety Technical Specifications for Garments Products.
This product features good stretchability. In the stretch test, it is not prone to elastic fibers exposure or broken stitches.
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