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hot-sale wire bonding process bonding bulk fabrication for automotive

hot-sale wire bonding process bonding bulk fabrication for automotive
  • hot-sale wire bonding process bonding bulk fabrication for automotive
  • hot-sale wire bonding process bonding bulk fabrication for automotive

hot-sale wire bonding process bonding bulk fabrication for automotive

Rocket PCB wire bonding process has an excellent design. It is designed by our experts with the highest quality materials and finishes. The tight compression makes it help in improving blood circulation to some extent
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hot-sale wire bonding process bonding bulk fabrication for automotive-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


hot-sale wire bonding process bonding bulk fabrication for automotive-2                
Consumer electronics
hot-sale wire bonding process bonding bulk fabrication for automotive-3                
Automotive electronics
hot-sale wire bonding process bonding bulk fabrication for automotive-4                
Communications
hot-sale wire bonding process bonding bulk fabrication for automotive-5                
Energy
hot-sale wire bonding process bonding bulk fabrication for automotive-6                
Industrial & Instrumentation
hot-sale wire bonding process bonding bulk fabrication for automotive-7                
IOT/Smart Home
hot-sale wire bonding process bonding bulk fabrication for automotive-8                
Medical electronics
hot-sale wire bonding process bonding bulk fabrication for automotive-9                
Security Industry

Rocket PCB wire bonding process has ensured quality. Its design has been tested over time to meet the challenges of the packaging and printing markets. It protects the skin from scratches and bruises
Rocket PCB wire bonding process has a green design. First-class materials that are recyclable and environmentally friendly are used for its production. The tight compression makes it help in improving blood circulation to some extent
The design of Rocket PCB wire bonding process takes a lot of effort. The design team devoted a lot of time to market research in the packaging and printing industries. At the same time. Customers' logos can be printed on this product
Rocket PCB wire bonding process is developed by our internal structural engineering team. This team is able to design packages that turn customers' visions and ideas into reality. It can provide support in case people have suffered an injury or a torn ligament
In terms of surface finishes, Rocket PCB wire bonding process provide all possible options. The surface treatment is available in a variety of ways. It will be carefully packaged with a dustproof polybag
We set a higher and higher standard for the quality of this product. It will not cause itching with soft and smooth fabrics
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