Rocket PCB  >  AI - Page Sitemap  >  hot-sale wire bonding process bonding bulk fabrication for automotive
hot-sale wire bonding process bonding bulk fabrication for automotive

hot-sale wire bonding process bonding bulk fabrication for automotive
  • hot-sale wire bonding process bonding bulk fabrication for automotive
  • hot-sale wire bonding process bonding bulk fabrication for automotive

hot-sale wire bonding process bonding bulk fabrication for automotive

The Imaging Science Foundation, or ISF, has certified Rocket PCB aluminum wire bonding process for its balanced color temperature. The certification differentiates this product from other projector screens that are so pervasive in the market. It has the function of low battery power alarm
Inquire Online
Get the latest price
Quantity Needed:
Pieces
E-mail:

methods


hot-sale wire bonding process bonding bulk fabrication for automotive-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


hot-sale wire bonding process bonding bulk fabrication for automotive-2                
Consumer electronics
hot-sale wire bonding process bonding bulk fabrication for automotive-3                
Automotive electronics
hot-sale wire bonding process bonding bulk fabrication for automotive-4                
Communications
hot-sale wire bonding process bonding bulk fabrication for automotive-5                
Energy
hot-sale wire bonding process bonding bulk fabrication for automotive-6                
Industrial & Instrumentation
hot-sale wire bonding process bonding bulk fabrication for automotive-7                
IOT/Smart Home
hot-sale wire bonding process bonding bulk fabrication for automotive-8                
Medical electronics
hot-sale wire bonding process bonding bulk fabrication for automotive-9                
Security Industry

The manufacture of Rocket PCB aluminum wire bonding process covers a few major steps. They include 3D graphic design, 3D printing, sample making, CNC milling, grinding, and so on. This product is the perfect holiday or birthday gift for kids aged 4
Rocket PCB wire bonding process will be checked in different aspects. These aspects cover dimensional stability, shock resistance, formaldehyde emission, bacteria and fungi resistance, etc. Its lightweight design helps roll over obstacles with ease
The design of Rocket PCB wire bonding process is based on humanistic functionalism that is pursued in the furniture industry. It attaches great importance on user experience, including elements of materials, texture, style, practicality, and color harmoniousness. Designed with 2.4GHz technology, it has a long remote-control range
The quality inspections of Rocket PCB wire bonding process have been carried out. These inspections are mainly smoothness, splicing trace, cracks, anti-fouling ability, stability, and durability. Its strong and high-efficiency motor provides a strong driving force
The design of Rocket PCB wire bonding process meets the standards. It is conducted by our designers who assess the viability of the concepts, aesthetics, spatial layout, egonomics, and safety. Its battery is easy to put in or replace
The healthy and environmentally friendly fabric will not cause the sensitive skin to flare up and become itchy, uncomfortable or even unbearable. Its electronic board is waterproof and dustproof
Product Message
Chat Online 编辑模式下无法使用
Chat Online inputting...
Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!