hot-sale wire bonding pcb gold wire for electronics

methods

Common PCB plating and wire bonding methods include

◪ Aluminum Wedge Wire Bonding and ENIG Plating

◪ Gold Ball Wire Bonding and soft gold plating

◪ Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Product application

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Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

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Medical electronics

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Security Industry

r******n

A variety of tests for Rocket PCB wire bonding pcb have been conducted. These tests include inflammability/ fire resistance testing, as well as chemical testing for lead content in surface coatings.

q******g

Extensive tests are carried out on Rocket PCB wire bonding pcb. They aim to ensure the product compliance with both national and international standards such as DIN, EN, BS and ANIS/BIFMA to name but few.

b******h

Rocket PCB wire bonding pcb is made of a heat-conducting material, and the thermal conductivity is improved, which ultimately helps to improve the heat dissipation rate.

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The design of Rocket PCB wire bonding pcb is innovatively completed. It is carried out by our renowned designers who aim to innovate furniture designs that reflect the newest aesthetic.

m******d

The design of Rocket PCB wire bonding pcb is professional and complicated. It covers several major steps that are carried out by exceptional designers, including sketch drawings, three-dimensional perspective drawing, mold making, and identification of whether the product fitting the space or not.

q******n

Perfect quality assurance and managing system jointly assure the quality of this product.