hot-sale wire bonding pcb gold wire for electronics

methods

Common PCB plating and wire bonding methods include

◪ Aluminum Wedge Wire Bonding and ENIG Plating

◪ Gold Ball Wire Bonding and soft gold plating

◪ Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Product application

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Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

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Medical electronics

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Security Industry

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Rocket PCB Solution Ltd. ensures that all the materials we use for wire bonding pcb are safe and environmentally friendly. Both it and its accessories can be OEMed and ODMed

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Made using best wire bonding pcb materials, wire bonding pcb is available in an array of colors and patterns to suit various occasions. The product is marketed with an independent intellectual property right

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There has been a steady demand in our market for this unique design of wire bonding pcb. A total of 10,000 pcs can be supplied per day

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wire bonding pcb has been developed using wire bonding pcb idea, which has some distinct characters, such as wire bonding pcb. The imported production equipment is run to guarantee accuracy and quality

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There are diverse models for wire bonding pcb to meet different demands. Innovation is always made to update the product and meet the market demand

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The product has the advantage of temperature resistance. Variations in temperature will not generate significant deviations in its stiffness or fatigue resistance, nor in any of its other mechanical properties. A total of 10,000 pcs can be supplied per day