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hot-sale wire bonding pcb gold wire for electronics

hot-sale wire bonding pcb gold wire for electronics
  • hot-sale wire bonding pcb gold wire for electronics
  • hot-sale wire bonding pcb gold wire for electronics

hot-sale wire bonding pcb gold wire for electronics

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methods

hot-sale wire bonding pcb gold wire for electronics-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
hot-sale wire bonding pcb gold wire for electronics-5                
Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Rocket PCB wire bonding pcb is developed under the combined principles of industrial design and modern scientific architecture. The development is carried out technicians who are devoted to the study of modern working or living space. Its output pressure can be easily adjustable
Rocket PCB wire bonding pcb is scientifically designed. Basic knowledge such as Mechanics of Machines, Mechanics of Materials, Fluid Mechanics, Thermodynamics is used in its manufacture. The product combines principles of simple operation with rugged construction
The first and most essential rule of Rocket PCB wire bonding pcb design is a balance. It is a combination of texture, pattern, color, etc. The product is lightweight and is easy to carry
Rocket PCB wire bonding pcb is made with many efforts. Materials engineers—specialists in the structure of materials and their properties—select and design the best combinations of materials for specific shoe purposes. The product is widely applied in the gas and petroleum industry
Rocket PCB wire bonding pcb has passed the necessary tests required by the industry. These tests are slip resistance testing, structural stability testing, tear strength testing, and thermal comfort testing. There is no heat generated during liquid transfer
The product is not subject to electromagnetic interference. Its coated insulation materials are carefully designed to stave off the magnetization. Its seal systems are designed for a long working life
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!