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hot-sale wire bonding pcb gold wire for electronics

hot-sale wire bonding pcb gold wire for electronics
  • hot-sale wire bonding pcb gold wire for electronics
  • hot-sale wire bonding pcb gold wire for electronics

hot-sale wire bonding pcb gold wire for electronics

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methods

hot-sale wire bonding pcb gold wire for electronics-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Each Rocket PCB wire bonding pcb is tailored to your needs in accordance with environmentally friendly manufacturing practices. [selling point, special sentence. It is very easy to install and disassemble
Rocket PCB wire bonding pcb is designed and fabricated using unmatched quality raw materials and latest technology as per the international quality criterion. The internal structure of the product compensates for shaft deflections and housing distortions caused by the heavy loads
wire bonding pcb is unusual in design and appropriate in size. It is not insensitive to the fluctuations in load and operating speed
Rocket PCB wire bonding pcb is endowed with exceptional appearance. Its beautiful design comes from our exclusive designers with strong innovation and design capabilities. The product has good acceptable axial load capacity in both directions
The production of Rocket PCB wire bonding pcb adopts internationally advanced technology to achieve efficient and standard production. The well-selected ferrules of the product make sure no mounting error
The product is of high quality and can withstand stringent quality and performance tests. The especially-designed logo can be printed on the product
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!