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hot-sale wire bonding pcb gold bulk fabrication for digital device

hot-sale wire bonding pcb gold bulk fabrication for digital device
  • hot-sale wire bonding pcb gold bulk fabrication for digital device
  • hot-sale wire bonding pcb gold bulk fabrication for digital device

hot-sale wire bonding pcb gold bulk fabrication for digital device

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methods

hot-sale wire bonding pcb gold bulk fabrication for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


hot-sale wire bonding pcb gold bulk fabrication for digital device-2                
Consumer electronics
hot-sale wire bonding pcb gold bulk fabrication for digital device-3                
Automotive electronics
hot-sale wire bonding pcb gold bulk fabrication for digital device-4                
Communications
hot-sale wire bonding pcb gold bulk fabrication for digital device-5                
Energy
hot-sale wire bonding pcb gold bulk fabrication for digital device-6                
Industrial & Instrumentation
hot-sale wire bonding pcb gold bulk fabrication for digital device-7                
IOT/Smart Home
hot-sale wire bonding pcb gold bulk fabrication for digital device-8                
Medical electronics
hot-sale wire bonding pcb gold bulk fabrication for digital device-9                
Security Industry

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This product has clearly printed texts. It can display information about the item such as materials, operation instructions, etc. This product features a low unwind force
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