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hot-sale wire bonding pcb finished bulk fabrication for automotive

hot-sale wire bonding pcb finished bulk fabrication for automotive
  • hot-sale wire bonding pcb finished bulk fabrication for automotive
  • hot-sale wire bonding pcb finished bulk fabrication for automotive

hot-sale wire bonding pcb finished bulk fabrication for automotive

Rocket PCB wire bonding pcb has attracting designs with consistency.
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hot-sale wire bonding pcb finished bulk fabrication for automotive-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


hot-sale wire bonding pcb finished bulk fabrication for automotive-2                
Consumer electronics
hot-sale wire bonding pcb finished bulk fabrication for automotive-3                
Automotive electronics
hot-sale wire bonding pcb finished bulk fabrication for automotive-4                
Communications
hot-sale wire bonding pcb finished bulk fabrication for automotive-5                
Energy
hot-sale wire bonding pcb finished bulk fabrication for automotive-6                
Industrial & Instrumentation
hot-sale wire bonding pcb finished bulk fabrication for automotive-7                
IOT/Smart Home
hot-sale wire bonding pcb finished bulk fabrication for automotive-8                
Medical electronics
hot-sale wire bonding pcb finished bulk fabrication for automotive-9                
Security Industry

When designing Rocket PCB wire bonding pcb, a team of creative designers are employed. It is designed to be ergonomic and user-friendly and thus meets the needs of customers.
Well-selected materials: the raw materials of Rocket PCB wire bonding pcb is well-selected by our quality team, which contributes to the product of high quality and excellent property.
The raw materials of Rocket PCB wire bonding pcb are meticulously selected to make sure each of them works perfectly, through which the quality of the product can be ensured from the source.
wire bonding pcb is manufactured under the visionary guidance of experts in accordance with global market standards with the aid of pioneering techniques.
Rocket PCB wire bonding pcb is specially made of well-selected and optimum materials.
This product has better quality and performance advantages compared to similar products.
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