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hot-sale wire bonding pcb finished bulk fabrication for automotive

hot-sale wire bonding pcb finished bulk fabrication for automotive
  • hot-sale wire bonding pcb finished bulk fabrication for automotive
  • hot-sale wire bonding pcb finished bulk fabrication for automotive

hot-sale wire bonding pcb finished bulk fabrication for automotive

The design procedures of Rocket PCB wire bonding pcb are professional, including CAD shadow band, creation of prototypes, creation of castable models, and 3D wax prototype. Its ergonomic design provides maximum grip force, which is convenient for doctors to use
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methods

hot-sale wire bonding pcb finished bulk fabrication for automotive-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


hot-sale wire bonding pcb finished bulk fabrication for automotive-2                
Consumer electronics
hot-sale wire bonding pcb finished bulk fabrication for automotive-3                
Automotive electronics
hot-sale wire bonding pcb finished bulk fabrication for automotive-4                
Communications
hot-sale wire bonding pcb finished bulk fabrication for automotive-5                
Energy
hot-sale wire bonding pcb finished bulk fabrication for automotive-6                
Industrial & Instrumentation
hot-sale wire bonding pcb finished bulk fabrication for automotive-7                
IOT/Smart Home
hot-sale wire bonding pcb finished bulk fabrication for automotive-8                
Medical electronics
hot-sale wire bonding pcb finished bulk fabrication for automotive-9                
Security Industry

Rocket PCB wire bonding pcb will be strictly inspected in regards to its appearance, dimension, and properties by the QC team. All these inspection parts are conducted in line with the hardware industry. Due to its flexibility, the product will not cause discomfort to the patient
During the developing of Rocket PCB wire bonding pcb, several important factors are considered such as sink level requirements, component level requirements, system level requirements, and chassis level requirements, to achieve the optimized heat transfer effect. It will not cause any infection and microbial contamination
Rocket PCB wire bonding pcb is manufactured by using only the latest advanced technology and the superior materials to guarantee the highest levels of quality, reliability, and durability in temporary structure constructions. With an ergonomic design, this product is easy for doctors to operate
Professional knowledge is used in the design of Rocket PCB wire bonding pcb. The R&D team utilizes the theories of the photoelectric effect, photochemistry reaction, and photothermal conversion to maximize the performance of the product. It is perfectly applicable to face, arm, abdominal, back, buttock and thigh
Rocket PCB wire bonding pcb has to go through diverse tests. These tests include destructive or non-destructive testing, dimensional inspections, chemical resistance testing, and visual inspection. It is perfectly applicable to face, arm, abdominal, back, buttock and thigh
The product can bear the most demanding industrial conditions. It is made of heavy-duty materials such as steel alloys and is not prone to rust and corrosion. The product has compatibility with living tissue
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