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hot-sale wire bonding finished bulk fabrication for automotive

hot-sale wire bonding finished bulk fabrication for automotive
  • hot-sale wire bonding finished bulk fabrication for automotive
  • hot-sale wire bonding finished bulk fabrication for automotive
  • hot-sale wire bonding finished bulk fabrication for automotive

hot-sale wire bonding finished bulk fabrication for automotive

The purifying technology of Rocket PCB wire bonding has been optimized. It is carried out by our engineers who try to achieve the great purifying effect while shortening the time. The surface of it has been treated with special polishing, making it retain its original shine after many times of uses
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Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

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methods


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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



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Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
hot-sale wire bonding finished bulk fabrication for automotive-8                
Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Rocket PCB wire bonding is manufactured by a team of skilled workers who adopt advanced welding technology to ensure that all joints are neat and robust.
Rocket PCB wire bonding is developed by our R&D engineers who have developed systems that can reduce the harmful impacts of chemical refrigerants. It is lightweight yet very tough, which makes it not buckle under the great weight
All manufacturing processes and test procedures of Rocket PCB wire bonding are strictly overseen by our professional workers according to the standards of building materials. Its excellent strength can make it retain original shape at both very high and very low temperatures
The development and design of Rocket PCB wire bonding is a complex process with medical industry regulations, specifications, application requirements, and patients' needs. The product had passed the SGS Natural Salt Spray Test, which means it is acid and alkali resistant
Rocket PCB [wire bonding is of high performance. It has undergone professional and strict spectral and photoelectric analysis to has high luminous efficiency. Featuring reusability, this product is environmental-friendly
The strict quality control system is adopted to provide a strong guarantee for the quality of the product. Featuring reusability, this product is environmental-friendly
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!