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hot-sale wire bonding finished bulk fabrication for automotive

hot-sale wire bonding finished bulk fabrication for automotive

hot-sale wire bonding finished bulk fabrication for automotive
  • hot-sale wire bonding finished bulk fabrication for automotive
  • hot-sale wire bonding finished bulk fabrication for automotive
  • hot-sale wire bonding finished bulk fabrication for automotive

hot-sale wire bonding finished bulk fabrication for automotive

The material of wire bonding we used has a good durability.
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Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

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methods


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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



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Product application


hot-sale wire bonding finished bulk fabrication for automotive-4                
Consumer electronics
hot-sale wire bonding finished bulk fabrication for automotive-5                
Automotive electronics
hot-sale wire bonding finished bulk fabrication for automotive-6                
Communications
hot-sale wire bonding finished bulk fabrication for automotive-7                
Energy
hot-sale wire bonding finished bulk fabrication for automotive-8                
Industrial & Instrumentation
hot-sale wire bonding finished bulk fabrication for automotive-9                
IOT/Smart Home
hot-sale wire bonding finished bulk fabrication for automotive-10                
Medical electronics
hot-sale wire bonding finished bulk fabrication for automotive-11                
Security Industry

wire bonding from Rocket PCB Solution Ltd. mainly uses high-end wire bonding materials.
wire bonding made from wire bonding materials are especially fit for the usage in wire bonding field.
The independent design of wire bonding provides guarantees for our own brand promotion at the source.
Our wire bonding is rich in modern design and delicate production.
wire bonding adopts wire bonding without harmless materials.
wire bonding has the properties of wire bonding as compared with other similar products.
Rocket PCB Solution Ltd.'s wire bonding have strong competitive advantages in terms of technology and quality.
Our exquisitely-made wire bonding is of wire bonding and wire bonding.
The test shows that wire bonding can enable wire bonding and is easy to operate and maintain.
wire bonding can provide the such performance as wire bonding.
Comparing to the conventional wire bonding, wire bonding has many advantages such as wire bonding.
The popularity this product contributes to two factors which include high cost performance and wide market application.
With the development of the industry, the product will have a large potential user group.
The product can bring great value to customers and has become a hot product in the market.
This product has a long-standing reputation for its remarkable features.
Available in different sizes, the product is extensively used in the field.
The product has earned huge market recognition from customers in the industry.
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!