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hot-sale wire bonding finished bulk fabrication for automotive

hot-sale wire bonding finished bulk fabrication for automotive
  • hot-sale wire bonding finished bulk fabrication for automotive
  • hot-sale wire bonding finished bulk fabrication for automotive
  • hot-sale wire bonding finished bulk fabrication for automotive

hot-sale wire bonding finished bulk fabrication for automotive

Different cutting-edge technologies have been used in Rocket PCB wire bonding. It is produced adopting intelligent control, sensing, and servo-drive technology. Keep Quality In Mind, Embed Quality In Mold
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Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

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methods


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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



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Product application


hot-sale wire bonding finished bulk fabrication for automotive-4                
Consumer electronics
hot-sale wire bonding finished bulk fabrication for automotive-5                
Automotive electronics
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Communications
hot-sale wire bonding finished bulk fabrication for automotive-7                
Energy
hot-sale wire bonding finished bulk fabrication for automotive-8                
Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

The workmanship of Rocket PCB wire bonding requires particular skills of machinists. It has to be welded, stamped, and brazed by professional workers, and its parts are put together and fastened by hands during assembly. Precision Makes Perfection
The components or parts used in Rocket PCB wire bonding are required to pass relevant requirements. They will be inspected or tested for strength, hardness, durability, and other mechanical properties using different testing methods. Quality - What Modern Does The Best
Rocket PCB wire bonding is the integration of various latest technologies. It is designed by CAD, fabricated under precise CNC machines, equipped with advanced PLC control, etc. Exquisite Techniques Brings Excellent Quality
Rocket PCB wire bonding undergoes a set of production processes. Its mechanical parts will be welded, stamped, burr removed and tested under pressure and temperature. Quality - What Modern Does The Best
Rocket PCB wire bonding is manufactured involving several stages. These stages include metal materials preparation, parts machining such as cams, shafts, and bearing, installations of fixtures&gauges, etc. Keep Quality In Mind, Embed Quality In Mold
The quality of this product can be guaranteed by Rocket PCB. Modern, Committed to Excellence
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!