hot-sale wire bonding fabrication surface finished for automotive

Company Advantages
1. Rocket PCB undergoes a series of manufacturing processes. It has to be cut, forged, stamped, cast, honed, and polished respectively under machines. It makes the interconnections less bulky
2. The product provides a good way to reduce the use of energy, which significantly helps save people's energy costs. The product allows the installation and repair process to be convenient
3. This product has the required bonding. It has been tested for the peel strength of adhesive bonds between constructions. The product features low electric currents and radiation emission
4. This product is able to offer the desired stability. It has a sturdy structure to withstand vertical or horizontal movement of the feet. Thanks to the application of the shielding layer, its signal distortion is reduced
5. This product is stain resistant to some extent. There is comparatively more effort placed on assessing its materials for resistance to general soiling in the manufacturing. Its parts are spaced evenly and traces are symmetric and uniform

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Company Features
1. Due to our extensive experience, Rocket PCB Solution Ltd. is one of the most popular suppliers of in the Chinese and international markets. Rocket PCB Solution Ltd. has a complete and scientific quality management system.
2. By implementing technology, the strength of Rocket PCB has been greatly improved.
3. Rocket PCB Solution Ltd. is powerful and strong in R&D capability. Sustainability is a core element of our company. We have made and strictly follow the product criteria that take into account sustainability aspects across the entire life cycle for the evaluation of products.