hot-sale semiconductor wire bonding professional surface finished for digital device

methods

Common PCB plating and wire bonding methods include

◪ Aluminum Wedge Wire Bonding and ENIG Plating

◪ Gold Ball Wire Bonding and soft gold plating

◪ Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Product application

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Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

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Medical electronics

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Security Industry

s******g

Rocket PCB Solution Ltd. In the manufacturing of semiconductor wire bonding, we have strict requirements and strive for excellence. We not only strictly control the raw materials, but also establish a quality inspection system in accordance with international relevant product testing standards to ensure that every product we sell is qualified and of high quality. Up to standard.

f******l

semiconductor wire bonding It is made of imported high-quality raw materials and processed by advanced technology. In addition, semiconductor wire bonding will be tested by relevant national departments after the production and processing is completed. It meets the national quality standards. It is a product with stable performance and high quality. Quality product.

p******n

As a professional semiconductor wire bonding manufacturer, Rocket PCB Solution Ltd. has rich production experience, advanced production equipment, superb production technology and strong production strength, capable of producing high-quality semiconductor wire bonding.

k******h

Rocket PCB Solution Ltd. has an experienced production team, which provides a strong guarantee for the high output of semiconductor wire bonding. Not only that, the company has also set up a QC team, which is responsible for testing the quality of semiconductor wire bonding to ensure its quality Superior, extraordinary quality.

v******d

Rocket PCB Solution Ltd. Pay attention to product quality, and strictly follow relevant standards in the process of product planning, design, manufacturing, testing, and transportation. The semiconductor wire bonding produced is not only stable in performance, high in safety, but also of excellent quality and high quality .

n******k

The product meets international quality standards and can withstand any rigorous quality and performance testing. The product provides a high-accuracy testing result