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High precision any layer HDI multilayer PCB fabrication

High precision any layer HDI multilayer PCB fabrication
  • High precision any layer HDI multilayer PCB fabrication
  • High precision any layer HDI multilayer PCB fabrication
  • High precision any layer HDI multilayer PCB fabrication
  • High precision any layer HDI multilayer PCB fabrication

High precision any layer HDI multilayer PCB fabrication

Anylayer/ ELIC (Every layer interconnection)
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Company Advantages
1. Developed from industrial raw material the offered double layer pcb features clean appearance. Its assembly process is conducted by a computer, leaving very little room for error
2. With an annual sales for HDI PCB fabrication volume ranking first in the industry, Rocket PCB Solution Ltd.'s sales volume of self-owned brands ranks first in China's double layer pcb companies. Its signal paths are well organized and exposed quite well
3. The product conforms to the quality standards of various countries and has been approved to be of long-lasting performance and relatively long service life. It improves the wiring density and reduces the spacing of components
4. The products are internationally certified and have a longer service life than other products. The software program arranges its parts for best performance
5. The product has reliable and consistent quality thanks to the detailed quality inspection throughout the whole production. It makes the interconnections less bulky


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

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ROCKET PCB Any Layer PCB (ELIC)process flow




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Anylayer PCB DFM suggestion for layout


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Product FEATURES


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  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices



The technology of making any layer HDI is summarized as follows


1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.

 

With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. is sophisticated in manufacture high quality double layer pcb products.
2. Over hundreds of skilled pcb manufacturing process technicians provide customers with the most sophisticated products.
3. Rocket PCB Solution Ltd. is committed to provide satisfactory services to the clients. Inquiry!
The whole production of Rocket PCB pcb manufacturing process is handled by our professional production team using the advanced technology and equipment. Its great flexibility makes it adaptable to any package requirements
The production of Rocket PCB double layer pcb strictly complies with ISO standard manufacturing processes. The product has a wide range of usage for the furniture industry
Rocket PCB HDI PCB fabrication is exquisitely manufactured by combining both advanced technique and premium-quality materials. The company logo or slogan can be printed on this product
Rocket PCB pcb manufacturing process is made as per the international quality standards. The product can effectively prevent the wrapped item from scattering while moving
The whole manufacture process for Rocket PCB HDI PCB fabrication is finished by our experienced pprofessionals by using the latest advanced equipment. The company logo or slogan can be printed on this product
This product has good durability and is suitable for long-term use and storage. The product has the advantage of great sealing property
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: hans.hu@rocket-pcb.com welcome to consult!