double layer pcb ,HDI PCB fabrication

Company Advantages
1. We manufacture Rocket PCB HDI PCB fabrication using high-grade materials sourced from reliable vendors. It reduces the need for interconnecting wiring
2. This product will offer good support and conform to a noticeable extent – particularly side sleepers who want to improve their spinal alignment. Its signal paths are well organized and exposed quite well
3. The product is nearly free of porosity. Fired at a high temperature above 1260°C, its body will vitrify, hence the surface will be nonabsorbent. It is properly laid out, giving less electronics noise
4. The product has become renowned for its energy efficiency. The refrigeration systems used can effectively move heat energy out of one area and into another, consuming little electricity. It is subjected to extreme heat and soldered into place

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

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ROCKET PCB Any Layer PCB （ELIC）process flow

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Anylayer PCB DFM suggestion for layout

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Product FEATURES

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◪ Any Layer PCBs with laser vias and filled plating on each layer

◪ 0.4mm thin spacing CSP supported by Any layer interconnection

◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

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SPECIALIZED MANUFACTURING

Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

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CAPABILITIES

3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias

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EXTENSIVE ANALYTICAL TESTING

Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing

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FEATURES

PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias

Product application

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Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

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Medical electronics

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Security Industry

Company Features
1. Specialized in production double layer pcb , Rocket PCB Solution Ltd. immediately stood out in the market.
2. By maintaining innovating the pcb manufacturing process technology, we could stay ahead in the market.
3. Rocket PCB Solution Ltd. sincerely invite you to visit our factory any time. Inquire!

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Rocket PCB HDI PCB fabrication has to go through a broad array of evaluation. It is assessed to meet local and international standards for electrical safety, sanitation, EMC, energy efficiency, and more. All parts are finely welded with high quality

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Rocket PCB double layer pcb involves different manufacturing processes. These processes may include cold stamping, plastic pressing, insulation, resistance welding, and electrical component heat treatment. This product stands up to repetitive machining operations

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Rocket PCB double layer pcb is exclusively designed. Many factors have been taken into considerations, from the circuit diagram to PCB CAD design or PCB layout. The product has advantages in thick or long plates

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The design of Rocket PCB pcb manufacturing process takes advantage of high-tech. Its parts drawing, assembly drawing, arrangement diagram, schematic diagram, and shaft drawing are all available by the mechanical drawing technologies. The product has the advantage of high rigidity

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Rocket PCB double layer pcb is sophisticatedly designed. Our architects and engineers consider many issues when working with the design, including environmental issues, aesthetic appearance, occupant comfort, and view. The product is best known for dynamic response characteristics

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HDI PCB fabrication ensures pcb manufacturing process to be operated on the safe side. With sensors to detect the position in real-time, it guarantees high precision

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