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High multilayer anylayer HDI PCB stacked and stagged mircovias

High multilayer anylayer HDI PCB stacked and stagged mircovias
  • High multilayer anylayer HDI PCB stacked and stagged mircovias
  • High multilayer anylayer HDI PCB stacked and stagged mircovias
  • High multilayer anylayer HDI PCB stacked and stagged mircovias
  • High multilayer anylayer HDI PCB stacked and stagged mircovias

High multilayer anylayer HDI PCB stacked and stagged mircovias

The product is nearly free of porosity. Fired at a high temperature above 1260°C, its body will vitrify, hence the surface will be nonabsorbent. It is properly laid out, giving less electronics noise
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Company Advantages
1. We manufacture Rocket PCB HDI PCB fabrication using high-grade materials sourced from reliable vendors. It reduces the need for interconnecting wiring
2. This product will offer good support and conform to a noticeable extent – particularly side sleepers who want to improve their spinal alignment. Its signal paths are well organized and exposed quite well
3. The product is nearly free of porosity. Fired at a high temperature above 1260°C, its body will vitrify, hence the surface will be nonabsorbent. It is properly laid out, giving less electronics noise
4. The product has become renowned for its energy efficiency. The refrigeration systems used can effectively move heat energy out of one area and into another, consuming little electricity. It is subjected to extreme heat and soldered into place


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




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Anylayer PCB DFM suggestion for layout


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Product FEATURES


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  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

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SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

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CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





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EXTENSIVE ANALYTICAL TESTINGHigh multilayer anylayer HDI PCB stacked and stagged mircovias-10


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing



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FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias







Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Specialized in production double layer pcb , Rocket PCB Solution Ltd. immediately stood out in the market.
2. By maintaining innovating the pcb manufacturing process technology, we could stay ahead in the market.
3. Rocket PCB Solution Ltd. sincerely invite you to visit our factory any time. Inquire!
double layer pcb The material is carefully selected, the porcelain is thick, the workmanship is exquisite, and the quality is high. It has smooth and delicate porcelain, beautiful and generous, durable.
pcb manufacturing processThe material is excellent, the materials are full, the design is exquisite, the shape is unique, it conforms to the public's aesthetics, and has a certain ornamental value. It is very suitable for giving blessings to relatives and friends on festive festivals.
The reel of pcb manufacturing process is made of high-quality ABS engineering plastics, with firm and reliable structure, exquisite workmanship, beautiful appearance, strong practicability and durability.
The cabinet of HDI PCB fabrication adopts multi-faceted and multi-angular three-dimensional design, with solid structure, exquisite and beautiful shape, reliable quality and durability.
We insist on selecting high-quality raw materials, and use fine processing technology to manufacture axle products. The pcb manufacturing process produced is moderate in weight, accurate in size, excellent in workmanship, and reliable in quality, and is very popular in the market.
We have a complete set of quality assurance system and sophisticated testing equipment to ensure its quality. It will not cause any infection and microbial contamination
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, and we will reply to you ASAP. Welcome, what can I help you?
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