Rocket PCB  >  AI - Page Sitemap  >  High multilayer anylayer HDI PCB stacked and stagged mircovias
High multilayer anylayer HDI PCB stacked and stagged mircovias

High multilayer anylayer HDI PCB stacked and stagged mircovias
  • High multilayer anylayer HDI PCB stacked and stagged mircovias
  • High multilayer anylayer HDI PCB stacked and stagged mircovias
  • High multilayer anylayer HDI PCB stacked and stagged mircovias
  • High multilayer anylayer HDI PCB stacked and stagged mircovias

High multilayer anylayer HDI PCB stacked and stagged mircovias

The product is nearly free of porosity. Fired at a high temperature above 1260°C, its body will vitrify, hence the surface will be nonabsorbent. It is properly laid out, giving less electronics noise
Inquire Online
Get the latest price
Quantity Needed:
Pieces
E-mail:
Company Advantages
1. We manufacture Rocket PCB HDI PCB fabrication using high-grade materials sourced from reliable vendors. It reduces the need for interconnecting wiring
2. This product will offer good support and conform to a noticeable extent – particularly side sleepers who want to improve their spinal alignment. Its signal paths are well organized and exposed quite well
3. The product is nearly free of porosity. Fired at a high temperature above 1260°C, its body will vitrify, hence the surface will be nonabsorbent. It is properly laid out, giving less electronics noise
4. The product has become renowned for its energy efficiency. The refrigeration systems used can effectively move heat energy out of one area and into another, consuming little electricity. It is subjected to extreme heat and soldered into place


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



High multilayer anylayer HDI PCB stacked and stagged mircovias-1





High multilayer anylayer HDI PCB stacked and stagged mircovias-2
Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




High multilayer anylayer HDI PCB stacked and stagged mircovias-3



Anylayer PCB DFM suggestion for layout


High multilayer anylayer HDI PCB stacked and stagged mircovias-4

High multilayer anylayer HDI PCB stacked and stagged mircovias-5



Product FEATURES


High multilayer anylayer HDI PCB stacked and stagged mircovias-6

  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

High multilayer anylayer HDI PCB stacked and stagged mircovias-7


SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

High multilayer anylayer HDI PCB stacked and stagged mircovias-8


CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





High multilayer anylayer HDI PCB stacked and stagged mircovias-9

EXTENSIVE ANALYTICAL TESTINGHigh multilayer anylayer HDI PCB stacked and stagged mircovias-10


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing



High multilayer anylayer HDI PCB stacked and stagged mircovias-11


FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias







Product application


High multilayer anylayer HDI PCB stacked and stagged mircovias-12                
Consumer electronics
High multilayer anylayer HDI PCB stacked and stagged mircovias-13                
Automotive electronics
High multilayer anylayer HDI PCB stacked and stagged mircovias-14                
Communications
High multilayer anylayer HDI PCB stacked and stagged mircovias-15                
Energy
High multilayer anylayer HDI PCB stacked and stagged mircovias-16                
Industrial & Instrumentation
High multilayer anylayer HDI PCB stacked and stagged mircovias-17                
IOT/Smart Home
High multilayer anylayer HDI PCB stacked and stagged mircovias-18                
Medical electronics
High multilayer anylayer HDI PCB stacked and stagged mircovias-19                
Security Industry

Company Features
1. Specialized in production double layer pcb , Rocket PCB Solution Ltd. immediately stood out in the market.
2. By maintaining innovating the pcb manufacturing process technology, we could stay ahead in the market.
3. Rocket PCB Solution Ltd. sincerely invite you to visit our factory any time. Inquire!
The materials of Rocket PCB HDI PCB fabrication are strictly selected and their quality reaches the international packaging standards, which helps this product withstand the test of the time. It can be customized according to customers' desire
The design of Rocket PCB HDI PCB fabrication can be customized after negotiating with our design team. For examples, the pattern can be printed on this product and it comes with various sizes. It is carefully and meticulously polished and burnisheed
The materials of Rocket PCB HDI PCB fabrication are supplied based on the commitment to the environment - a family of eco-friendly materials designed to manufacture the sustainable product. It is of delicate, modern and compact style
When it comes to materials and finishes, Rocket PCB double layer pcb comes with every possible option. Its materials are purchased from reliable suppliers and its finishes can be treated via various methods. Manufactured by sturdy materials, the product can serve customers for many years
Rocket PCB double layer pcb is designed by our designers who carefully check the suitability of the chosen solution and give valuable advice concerning the selection of materials and finishes. The product adopts the PVD or electroplating technology to retain coating stability
The complete quality control system makes sure that this product is of high quality. The product is manufactured based on highly innovative ideas
Product Message
Chat Online 编辑模式下无法使用
Chat Online inputting...
Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: hans.hu@rocket-pcb.com welcome to consult!