double layer pcb ,HDI PCB fabrication

Company Advantages
1. We manufacture Rocket PCB HDI PCB fabrication using high-grade materials sourced from reliable vendors. It reduces the need for interconnecting wiring
2. This product will offer good support and conform to a noticeable extent – particularly side sleepers who want to improve their spinal alignment. Its signal paths are well organized and exposed quite well
3. The product is nearly free of porosity. Fired at a high temperature above 1260°C, its body will vitrify, hence the surface will be nonabsorbent. It is properly laid out, giving less electronics noise
4. The product has become renowned for its energy efficiency. The refrigeration systems used can effectively move heat energy out of one area and into another, consuming little electricity. It is subjected to extreme heat and soldered into place

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

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ROCKET PCB Any Layer PCB （ELIC）process flow

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Anylayer PCB DFM suggestion for layout

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Product FEATURES

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◪ Any Layer PCBs with laser vias and filled plating on each layer

◪ 0.4mm thin spacing CSP supported by Any layer interconnection

◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

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SPECIALIZED MANUFACTURING

Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

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CAPABILITIES

3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias

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EXTENSIVE ANALYTICAL TESTING

Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing

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FEATURES

PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias

Product application

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Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

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Medical electronics

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Security Industry

Company Features
1. Specialized in production double layer pcb , Rocket PCB Solution Ltd. immediately stood out in the market.
2. By maintaining innovating the pcb manufacturing process technology, we could stay ahead in the market.
3. Rocket PCB Solution Ltd. sincerely invite you to visit our factory any time. Inquire!

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Rocket PCB double layer pcb will be checked in various parameters. A battery function tester has been used to check its open-circuit voltage, the internal resistance of the cell, and protection level. While used in the manufacturing cycle, it enables all types of parts to be protected

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Rocket PCB pcb manufacturing process is meticulously manufactured. The engineers will again and again confirm the geometric details supplied are correct before the commencement of work. It is less prone to produce static electricity

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Rocket PCB pcb manufacturing process has been tested by third-party testing organizations. It has been checked in terms of miter edge lamination, polish, flatness, hardness, and straightness. The adhesive provides a reliable bond under environmental stress like changing moisture

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Rocket PCB HDI PCB fabrication meets a variety of international standards for electric appliances. They are CARB, FCC, ETL, UL, CB, CCC and so on. Maximum sealing for goods is promised by this product

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Right fabric is adopted for Rocket PCB pcb manufacturing process. It is chosen by our experienced designers who know how a fabric will drape and feel. Users will experience a feeling of perfection and efficiency

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The product is stable in quality and superior in performance. It is solvent-, moisture-, and abrasion-resistant

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