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High multilayer anylayer HDI PCB stacked and stagged mircovias

High multilayer anylayer HDI PCB stacked and stagged mircovias

High multilayer anylayer HDI PCB stacked and stagged mircovias

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Product Details
With the pursuit of excellence, Rocket PCB is committed to showing you unique craftsmanship in details.Rocket PCB provides diversified choices for customers. HDI PCB is available in a wide range of types and styles, in good quality and in reasonable price.
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Product Comparison
Rocket PCB insists on the use of high-quality materials and advanced technology to manufacture HDI PCB. Besides, we strictly monitor and control the quality and cost in each production process. All this guarantees the product to have high quality and favorable price.Rocket PCB's HDI PCB has better quality than other products in the industry, which is specifically shown in the following aspects.
  • news-High multilayer anylayer HDI PCB stacked and stagged mircovias-Rocket PCB-img
    news-Rocket PCB-High multilayer anylayer HDI PCB stacked and stagged mircovias-img
Company Advantages
1. Adherence to design principle of HDI PCB fabrication makes possible the use of double layer pcb more pcb prototyping .
2. Our dedicated and skilled quality controllers carefully inspect the product at every step of production in order to ensure that its quality remains exceptional without any defect.
3. A full in-house laboratory is available to ensure the consistency and quality of the raw material.
4. Under strict quality tests, double layer pcb is of high quality when arriving to customers.
5. Rocket PCB Solution Ltd. has had excellent customer service and sales support throughout the process.


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




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Anylayer PCB DFM suggestion for layout


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Product FEATURES


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  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

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SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

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CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





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EXTENSIVE ANALYTICAL TESTINGapplication-Rocket PCB-img-1


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing



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FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias







Product application


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Consumer electronics
application-High multilayer anylayer HDI PCB stacked and stagged mircovias-Rocket PCB-img-1                
Automotive electronics
High multilayer anylayer HDI PCB stacked and stagged mircovias-Rocket PCB-img-1                
Communications
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Energy
High multilayer anylayer HDI PCB stacked and stagged mircovias-pcb fabrication, PCB maker, PCB manuf-1                
Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. As a top double layer pcb supplier, Rocket PCB Solution Ltd. has been making much progress in the market.
2. Rocket PCB Solution has some of the world's leading researchers in the HDI PCB fabrication field.
3. With pcb prototyping being its service philosophy, Rocket PCB Solution Ltd. provides dual layer pcb . Get info! HDI PCB fabrication is Rocket PCB Solution Ltd. original service philosophy, which fully shows its own superiority. Get info! Rocket PCB Solution Ltd. makes use of HDI PCB fabrication service concept to construct large power customer management information system. Get info!
Favorable rate
100%
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!