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fabrication wire bonding pcb surface finished for automotive

fabrication wire bonding pcb surface finished for automotive

fabrication wire bonding pcb surface finished for automotive
  • fabrication wire bonding pcb surface finished for automotive
  • fabrication wire bonding pcb surface finished for automotive

fabrication wire bonding pcb surface finished for automotive

Name:
wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
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Quantity Needed:
Pieces
E-mail:
Product Details
Rocket PCB's HDI PCB is exquisite in details.Rocket PCB carefully selects quality raw materials. Production cost and product quality will be strictly controlled. This enables us to produce HDI PCB which is more competitive than other products in the industry. It has advantages in internal performance, price, and quality.
Company Advantages
1. wire bonding pcb is composed of ic wire bonding .
2. The performance of this product is assured by your QC team.
3. This product has really contributed a lot to my business. It has the advantages of easy operation and maintenance, which greatly lowers my operation costs. - One of our customers said.
4. The product is highly sterile and hygeian, which makes patients free from the risk of cross-infection, keeping them safe.

methods


Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


               
Consumer electronics
               
Automotive electronics
               
Communications
               
Energy
               
Industrial & Instrumentation
               
IOT/Smart Home
               
Medical electronics
               
Security Industry

Company Features
1. Rocket PCB has made great achievements in wire bonding pcb business.
2. Rocket PCB Solution Ltd. has a group of staff full of vitality and enthusiasm.
3. Rocket PCB Solution Ltd. is committed to producing the most valuable wire bonding technology with less cost. Inquire now! Imported from the foreign countries, our advanced machine can guarantee the strict process of wire bonding process . Inquire now! Our motto is to put ic wire bonding first and to list semiconductor wire bonding as our target. Inquire now! We adhere to the our commitment and put wire bonding into practice. Inquire now!
Favorable rate
100%
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!