board aluminium pcb board for led popular control for digital device

About our product

Heat is the biggest threat to LEDS and other silicon semiconductors. With the rapid development of electronic industry, the size of electronic products is getting smaller and smaller, and the power density is getting larger and larger. Solving the problem of heat dissipation is a huge challenge to industrial design. Aluminum Substrate is undoubtedly one of the effective means to solve the problem of heat dissipation.

Compared with the traditional FR-4, the aluminum substrate can minimize the thermal resistance and make the substrate excellent. Compared with the thick film ceramic circuit, its mechanical properties are excellent.

Aluminum substrate is a kind of copper clad laminate with good heat dissipation function. It consists of a unique three-layer structure, namely, circuit layer, thermal conductive insulation layer and metal base layer.

There are also the following unique advantages,

• Compliance with RoHs requirements

• In the design of electric circuit, thermal diffusion can be treated effectively.

• Reducing the operating temperature of the module, prolonging the service life, increasing the power density and reliability

• Reduce the assembly of radiator and other hardware (including thermal interface materials), reduce module size, and reduce hardware and assembly costs;

• Replacing fragile ceramic substrates for better mechanical durability

VS

> Our factories have invested heavily in importing advanced production facilities from abroad. Such as Burkle laminator, Mitsubishi laser drill, Hitachi mechanical drill, Japan screen automatic exposure machine, LDI, AOI etc, highly automated manufacturing. With a monthly output of up to 250,000 square meters.

> Our suppliers have formed a complete production process, become more professional, modern and large-scale, and signed long-term strategic cooperation agreements with well-known enterprises at home and abroad.

> Under the system of ISO 9001, ISO 14001, ISO/TS16949, OHSAS 18001, ISO/IEC27001, UL, SGS and RoHS, we have guaranteed our excellent quality and leading market position with strong technical development momentum. We also adhere to the 5S method, lean and Six Sigma quality system.

> We provide real-time and in-depth technical support. We offer the most effective and flexible solution for you. Such as high speed, large capacity, high frequency, mixed pressure (hybrid structure), heat dissipation metal base solutions.

> Free DRC and DFM. Elite engineers with years of experience provide you with free and comprehensive engineering review and support.

> Rapid feedback on the layout, build-up, panels, impedance, material selection, design rules, manufacturability, costs of different solutions, use of micro vias, gold plating, special laminates and other engineering questions. When providing innovative solutions for our customers'products, we always consider maximizing the benefits for our customers.

> Rocket provides industry-leading support to our customers,we are more willing to help customers grow.

Advanced Product and Advanced Technology 

> Quotation for standard projects within 2 hours, quick 24 hours PCB prototype making.

> Multiple different product lines meet the requests of fast delivery of small batches and multi-variety prototyping and mass production.

> Expedited production line for prototyping double-sided PCB up to 24 hours, 4 layers 48 hours, 6 layers 72 hours etc.

> Mass production of double-sided PCB 5-6 days lead time, multi-layer PCB 7-9 days for standard boards.

> DHL, FedEx, TNT, UPS Express, fully meet the customer's rapid turnover requirements, punctual delivery rate of more than 99%.

> Dozens of tests such as open/short circuit testing( ET test), AOI, X-ray, impedance testing, solderability testing, thermal shock testing, metallographic micro-slicing analysis, halogen-free testing, etc. 100% outgoing pass rate.

> Provide 1-64 layers of different thickness, different materials, different processes of product customization, of which the CCL using A-class raw materials, high quality assurance.

> Unlimited PCB capabilities,we provide various and advanced technology PCBs include rigid, FPC, rigid-flex, metal core, microwave/RF, HDI, any layer, heavy copper, large-size, embedded, LED, backplane, ceramic substrate, IC substrate, high-frequency, high-density and high-performance PCB.

> Eight major surface treatment technology and high-quality ink printing, beautiful and reliable.

In Rocket, with advanced production equipment, excellent PCB solutions and complete testing methods, we have specialists working on their particular fields with the thorough mastery of their particular discipline in each of the production facilities. Training, as well as technical exchanges, are held frequently, tackling problems in key technologies and configuring scheme of equipment and allowing professionals to get up to speed on the essential tools that many organizations value today in the manufacturing industry. Thanks to those above, we have greatly improved the strength and won international reputation.

SPECIALIZED MANUFACTURING

• Conductive materials and core-to-core bonding

• Embedded components
  

• RF connector attachment

• Laser direct imaging (LDI)
  

• Laser etching

• Laser forming
  

• Multi-level cavity construction

• Plated cavities and edges

• Composite/hybrid Structures

• N+N dual press-fit

• Dual-drill

• Bonding on metal core

• Bulid-up HDI

• Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

CAPABILITIES

• 3mil line and space

• 4mil laser defined vias

• 6mil chip-on-board

• 6mil mechanically drilled vias

• Conductive and non-conductive via fill

• Dual backdrilling

• Sequential lamination

• Mixed dielectric
  

• Heatsink Bonding

• Heavy copper/thermal vias

• Blind/buried vias

• Stacked and staggerd microvias

  
  

  
  

EXTENSIVE ANALYTICAL TESTING

• Design Rules Check(DRC)

• Electrical Testing

• Automated Optical Inspection(AOI)

• X-Ray

• Plating thickness testing

• Metalized vias inspection

• Thermal shock testing

• Surface peelability testing

• Impedance control testing

• 100% visual inspection

• Solderability testing

• Ionic cleanliness testing

• Metallographic microscopic analysis

• High voltage testing
  

• Insulating resistance testing

FEATURES

• PTFE

• High speed/low loss

• High temperature

• Low CTE

• Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
  

• Combination surface finished

• Copper-filled microvias

  
  

  
  

               

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