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wholesale simple pcb board bulk fabrication for electronics Rocket PCB

wholesale simple pcb board bulk fabrication for electronics Rocket PCB

Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
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Quantity Needed:
Pieces
E-mail:
Product Comparison
Rocket PCB's HDI PCB is manufactured in strict accordance with relevant national standards. Every detail matters in the production. Strict cost control promotes the production of high-quality and priced-low product. Such a product is up to customers' needs for a highly cost-effective product.HDI PCB has the following advantages over other products in the same category.
Company Advantages
1. The body frame lightweight design of printed circuit board industry have the extremely vital significance.
2. printed circuit board industry are recognized for their characteristics of simple pcb board.
3. This printed circuit board industry is especially practical for simple pcb board.
4. Rocket PCB Solution Ltd. idea on printed circuit board industry will revolutionize wire bonding technology and prove to be a worldwide hit.
5. Our simple pcb board system offers aluminum wire bonding process capability meeting production requirements.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding


methods


Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.





Product application


               
Consumer electronics
               
Automotive electronics
               
Communications
               
Energy
               
Industrial & Instrumentation
               
IOT/Smart Home
               
Medical electronics
               
Security Industry

Company Features
1. Rocket PCB Solution Ltd. is quite professional in the production process of printed circuit board industry.
2. Rocket PCB Solution Ltd. includes a topnotch group of scientific and technical experts.
3. We have a common vision and philosophy about business, people, ethics and service. Our success is achieved through honesty in thought, word, and action towards our clients, fellow employees, and suppliers. Check it! Rocket PCB Solution Ltd. is well prepared to deal with all difficulties and challenges. Check it! Our operational philosophy: dedication, gratitude, cooperation. This means that we regard talents, customers, team spirit as important for the development of our company. Check it! In order to create a healthy and sustainable living condition for the next generations, our company is trying best to protect the environment. We handle all the scrap, waste gases, and wastewater strictly in line with relevant regulations. Check it!
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!