top brand simple pcb board wire for digital device

Company Advantages
1. wire bonding technology from Rocket PCB Solution Ltd. is designed with simple pcb board performance.
2. The product is of the highest levels of safety and quality.
3. Rocket PCB Solution Ltd. possess a highly-efficient management team, strong R&D ability, professional customer service and large e-business platform.
4. Our wire bonding technology are of great performance for its highest quality.

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Company Features
1. With powerful technical force and advanced technology, Rocket PCB takes the lead in wire bonding technology industry.
2. We have facilities that work smoothly. Running under the supervision of highly professional staff and stringent computer monitoring, they provide the highest level of product consistency.
3. Rocket PCB Solution Ltd. is dedicated to be the top notch professional wire bonding company. Ask online! Diversified operations, intensified growth and continuous expansion of wire bonding pcb business is Rocket PCB Solution Ltd.'s strategic principle. Ask online! The unique spirit of Rocket PCB Solution Ltd. and the will to continue development have been confirmed all over the years. Ask online! Rocket PCB adopts an advanced technology, which insists on a principle of wire bonding process . Ask online!