thermal IC structure pcb pcb material conductivity for base material

Rocket PCB is good at process aluminium oxide ceramic-based copper clad laminate, alumina ceramic laminate, LED ceramic laminate, Al2O3 ceramic laminate, high thermal conduction ceramic PCB, ceramic-based CCL PCB

The ceramic-based board relies on ceramics as a matrix material and fabricates electronic parts of metal circuits thereon. it's an imperative basic material for module packaging in the electronic field. Ceramic substrates refer to the special method of copper foil bonding on to the surface of alumina (AL2Q3) or Al nitride (AlN) ceramic substrates (single or double sides) at high temperature. The ultra-thin composite substrate has wonderful electrical insulation, high thermal conduction, wonderful solderability and high adhesion strength. It will etch numerous patterns like PCB board and has nice current carrying capability. Therefore, the ceramic substrate has become the fundamental material of high-powered electronic circuit structure technology and is that the most suitable option for high-powered LED, power devices, microwave devices, automotive electronics, high-frequency devices, solar cell modules and alternative applications.

Product FEATURES

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Ceramics are superior to other printed circuit boards

◪ Strong mechanical stress, stable shape; high strength, high thermal conductivity, high insulation; strong bonding force, anti-corrosion

◪ Excellent thermal cycle performance, 50,000 cycles, high reliability

◪ Like PCB board structure (or IMS substrate) which can etch various graphics, it is pollution-free

◪ The temperature range is - 55 C to 850 C, and the thermal expansion coefficient is close to silicon, which simplifies the production process of power module

Product application

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Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

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Medical electronics

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Security Industry

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The mechanical components of Rocket PCB IC structure pcb are manufactured in virtue of many high technologies. They are produced under highly precise machines, including CNC machines, electroplating spraying equipment, and surface polishing machines.

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A wide range of parameters is taken into consideration when developing Rocket PCB IC structure pcb. The kinds of electrolyte, battery shell, the arrangement of the positive electrode and the negative electrode are all seriously considered.

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Rocket PCB IC structure pcb has been tested at the end of the production stage. It has been checked for its water absorption rate, deformability, surface cracks, etc.

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The materials used in the manufacture of Rocket PCB IC structure pcb have been taken into considerations. For example, metal materials used for electric conductors and insulating materials used for the prevention of accidental contact have been strictly controlled.

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The manufacturing process for Rocket PCB IC structure pcb is fastidious. Just one missed detail in the construction can result in the mattress not giving the desired comfort and levels of support.

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The company strictly controls the whole process of production, reduces production costs, improves production efficiency, and produces IC structure pcb with high quality and affordable prices.