any-layer pcb ,HDI PCB fabrication

Product Information

Enterprise Strength

Rocket PCB has sales service centers in multiple cities in the country. This enables us to promptly and efficiently provide consumers with quality products and services.

Application Scope

Rocket PCB's printed circuit board has wide application. Here are a few examples for you.Rocket PCB has an excellent team consisting of talents in R&D, production and management. We could provide practical solutions according to actual needs of different customers.

Company Advantages
1. Application shows that the reformed any-layer pcb has rational structure and HDI PCB fabrication performance.
2. Field operation indicates that any-layer pcb is of HDI PCB fabrication.
3. It is important to equip the projector with this product. Even the best projector will not be able to produce good images with correctly reproduced colors without a correctly selected screen.
4. 刘秋红

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

news-stacked HDI PCB fabrication anylayer at discount-Rocket PCB-img

news-Rocket PCB-stacked HDI PCB fabrication anylayer at discount-img

Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......

ROCKET PCB Any Layer PCB （ELIC）process flow

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Anylayer PCB DFM suggestion for layout

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Product FEATURES

◪ Any Layer PCBs with laser vias and filled plating on each layer

◪ 0.4mm thin spacing CSP supported by Any layer interconnection

◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

SPECIALIZED MANUFACTURING

Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

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CAPABILITIES

3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias

stacked HDI PCB fabrication anylayer at discount-Rocket PCB-img-1

EXTENSIVE ANALYTICAL TESTING

Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing

application-stacked HDI PCB fabrication anylayer at discount-Rocket PCB-img-1

FEATURES

PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias

Product application

Consumer electronics

Automotive electronics

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Communications

Energy

Industrial & Instrumentation

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IOT/Smart Home

stacked HDI PCB fabrication anylayer at discount-pcb fabrication, PCB maker, PCB manufacturer-Rocket-1

Medical electronics

Security Industry

Company Features
1. With specialist staff and rigorous management mode, Rocket PCB Solution Ltd. has grown into an internationally famous any-layer pcb manufacturer.
2. Rocket PCB Solution Ltd. has a high level of professional production and technical personnel and international advanced production equipment.
3. Promoting HDI PCB fabrication to achieve the value of Rocket PCB is the goal of the company. Please contact. The corporate mission of Rocket PCB Solution Ltd. is to dual layer pcb . Please contact. All of our staff must know our double layer pcb well before they start their jobs. Please contact. Rocket PCB Solution Ltd. aims to be a vanguard company in Chinese pcb manufacturing process industry. Please contact.

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