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Rocket PCB wholesale aluminum wire bonding process bulk fabrication for automotive

Rocket PCB wholesale aluminum wire bonding process bulk fabrication for automotive

Name:
wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Application Scope
Rocket PCB's HDI PCB can be used in different industries to meet the needs of customers.Rocket PCB always gives priority to customers and services. With a great focus on customers, we strive to meet their needs and provide optimal solutions.
  • Rocket PCB wholesale aluminum wire bonding process bulk fabrication for automotive-PCB prototype-pcb
Enterprise Strength
  • Based on customer demand, Rocket PCB insists on seeking excellence and taking innovation, so as to provide consumers with better services.
Company Advantages
1. The production of Rocket PCB aluminum wire bonding process is based on the industry's standards.
2. Its quality is monitored by the strict quality inspection team.
3. In the wire bonding technology industry, Rocket PCB now is a leading manufacturer in the market.

methods


Rocket PCB wholesale aluminum wire bonding process bulk fabrication for automotive-pcb fabrication,

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


Rocket PCB wholesale aluminum wire bonding process bulk fabrication for automotive-Rocket PCB-img                
Consumer electronics
Rocket PCB wholesale aluminum wire bonding process bulk fabrication for automotive-Rocket PCB-img                
Automotive electronics
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Communications
news-Rocket PCB wholesale aluminum wire bonding process bulk fabrication for automotive-Rocket PCB-i                
Energy
news-Rocket PCB-Rocket PCB wholesale aluminum wire bonding process bulk fabrication for automotive-i                
Industrial & Instrumentation
product-Rocket PCB wholesale aluminum wire bonding process bulk fabrication for automotive-Rocket PC                
IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. is globally known as a reliable supplier of wire bonding technology .
2. Rocket PCB Solution Ltd. has nationwide wire bonding manufacturing plants and sales offices.
3. Our pledge to our customers is 'quality and safety'. We promise to manufacture safe, harmless, and non-toxic products for customers. We will devote greater efforts to quality inspection, including its ingredients of raw materials, components, and the whole structure. Rocket PCB Solution Ltd. is very professional and loyal to the vision of exceeding customers. Ask online! In addition to seeking business development, we still strive to make a positive impact on our local communities. We use locally based resources rather than outsourcing them, hence, in this way, we can protect the home-grown jobs. Ask online!
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: hans.hu@rocket-pcb.com welcome to consult!