Company Advantages
1. Rocket PCB wire bonding services is developed by our professional R&D team, based on application scenarios and usage characteristics in the market. The product is focused to overcome the shortcomings among similar products.
2. Rocket PCB Solution Ltd. has carried out times of in-depth research on wire bonding technology. Its signal paths are well organized and exposed quite well
3. Our professional quality check team ensures this cost-effective and high performance product. It plays an important role in modern electronic equipment
4. The product has characteristics of high intensity and durability thanks to the adoption of the quality system. The product is widely applied in consumer electronics
5. A sound quality assurance better ensures the quality of this product. The product makes the process of replacing the particular failure components easier

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Company Features
1. As a domestically competitive producer, Rocket PCB Solution Ltd. is expanding its manufacturing scale. Rocket PCB has proficient staff to create an exquisite wire bonding .
2. With the help of technical strength, our wire bonding pcb is of good quality.
3. The demand for product quality and service in Rocket PCB Solution Ltd. is almost extreme. Rocket PCB Solution Ltd.'s bold strategy of wire bonding services gives it a competitive advantage. Ask!