Rocket PCB hot-sale wire bonding technology wire for automotive

Company Advantages
1. Developed by a professional R&D team, Rocket PCB semiconductor wire bonding has ultra-sensitive and responsive surface. The team always strive to improve its screen touch technology so as to provide better writing and drawing experience.
2. Our professional quality control team and authoritative third party have carefully and rigorously reviewed the product quality.
3. With precise strategic positioning and excellent implementation efficiency, Rocket PCB Solution Ltd. has achieved sustained high-speed growth.
4. Rocket PCB Solution Ltd. seeks to be a customer-driven wire bonding technology supplier.

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Company Features
1. The rich experience and good reputation bring Rocket PCB Solution Ltd. a great success for wire bonding technology .
2. The Technology Center of Rocket PCB has been persistently focusing on forward-looking technologies at home and abroad.
3. Rocket PCB Solution Ltd. will use independent technology research and development, vigorously develop printed circuit board industry. Ask! Always putting customers first and continuing to meet customer needs with semiconductor wire bonding can help Rocket PCB gain reputation. Ask! Striving to pursue wire bonding is our drive. Ask! Rocket PCB’s strategic vision is to become a world-class wire bonding process company with global competitiveness. Ask!