Rocket PCB gold wire bonding pcb bulk fabrication for electronics

Company Advantages
1. Rocket PCB semiconductor wire bonding is manufactured by our experienced workers who use optimum raw materials.
2. The product is zero-defect as we implement strict inspection on each stage of produciton process.
3. Its foreign markets have been developed by our identifying foreign consumer groups and consumer demand.
4. All these features provide probability for abroad application of this product.

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Company Features
1. Rocket PCB is a powerful company which enjoys high reputation in wire bonding pcb industry.
2. Rocket PCB has a dominant place in printed circuit board industry industry thanks to its semiconductor wire bonding .
3. Rocket PCB Solution Ltd. seeks sustainable growth of enterprise, employees and the whole community. Ask online! Rocket PCB Solution Ltd. aims to supply sound services for full satisfaction of customers. Ask online! Rocket PCB Solution Ltd. sincerely hopes our wire bonding process can bring great value to our customers. Ask online!