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Rocket PCB fabrication aluminum wire bonding process bulk fabrication for automotive

Rocket PCB fabrication aluminum wire bonding process bulk fabrication for automotive

Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
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Quantity Needed:
Pieces
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Product Details
With a focus on product quality, Rocket PCB strives for quality excellence in the production of HDI PCB.Rocket PCB is certified by various qualifications. We have advanced production technology and great production capability. HDI PCB has many advantages such as reasonable structure, excellent performance, good quality, and affordable price.
  • Rocket PCB fabrication aluminum wire bonding process bulk fabrication for automotive-Rocket PCB-img
Company Advantages
1. Rocket PCB Solution Ltd. can customize the colors, shapes and sizes according to the needs of clients.
2. The product is superior in the quality, excellent in the performance, and long in lifespan.
3. The product is of the finest quality in the industry as it surpassed the international quality standards.
4. The product has become the preferred product in the industry, seeing the great potential of the further application.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

Rocket PCB fabrication aluminum wire bonding process bulk fabrication for automotive-Rocket PCB-img


methods


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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



news-Rocket PCB fabrication aluminum wire bonding process bulk fabrication for automotive-Rocket PCB



Product application


news-Rocket PCB-Rocket PCB fabrication aluminum wire bonding process bulk fabrication for automotive                
Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
Rocket PCB fabrication aluminum wire bonding process bulk fabrication for automotive-Rocket PCB-img-1                
Security Industry

Company Features
1. Rocket PCB Solution Ltd. has ample money to support research and technical team for developing new wire bonding pcb .
2. aluminum wire bonding process technology is performed by our experienced technicians to make sure the quality of printed circuit board industry.
3. Rocket PCB Solution Ltd. has high demand on international sales to provide their best service for customers. Check it! The culture of wire bonding process in Rocket PCB has attracted more and more customers. Check it! Constant innovation is indispensable for long-term development of Rocket PCB Solution Ltd.. Check it!
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