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High-density Interconnect PCBs
To provide high-quality HDI PCB, the state-of-the-art production equipment is adopted by Rocket PCB Solution Ltd.
Our engineers adopt FR4 as its main material. It has met the industrial
design requirements. It better meets the market demands. The adoption
of LDI, Laser etching allows to deliver leading production efficiency.
Due to 4+N+4 structure capability, it gets such merits as improves the
wiring density of the inner signal layer, great help to Power integrity
and signal integrity. It mainly serves communication, medical, military,
security, industrial, automotive fields. It is approved by UL, SGS,
ROHS, ISO9001,ISO14001, TS16949. Your specific requirements on HDI PCB
are accepted. All your demand can be satisfied at www.rocket-pcb.com/
Rocket PCB focuses on high-tech and high-mixed PCB and is active in the
electronic manufacturing industry. We have focused on this industry for
more than 10 years years. Our product list includes rigid, rigid-flex,
HDI, any layer, Flex, large-size, embedded, RF, LED, backplane, metal
substrate, ceramic substrate, IC structure, high-frequency, heavy
copper. Industry-leading and years of experience in the HDI field
Our mission is to continually raise the bar of customer experience by
sticking to the business principle of 'Service creates value, service
wins respect and service builds brand '. Here at https://www.rocket-pcb.com more details can be found.
In Rocket, with advanced production equipment, excellent PCB solutions and complete testing methods, we have specialists working on their particular fields with the thorough mastery of their particular discipline in each of the production facilities. Training, as well as technical exchanges, are held frequently, tackling problems in key technologies and configuring scheme of equipment and allowing professionals to get up to speed on the essential tools that many organizations value today in the manufacturing industry. Thanks to those above, we have greatly improved the strength and won international reputation.
SPECIALIZED MANUFACTURING
Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro
CAPABILITIES
3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias
Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing
FEATURES
PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias
◪ 24 hour real-time technical support Quick turn around with 24 hours and instant quote. For HDI board, will be based on board parameters, normally 15-30 days.
◪ Effective and flexible PCB engineering solutions save your cost. We always put
the best interests first when providing innovative solutions for
manufacturing customers’ products,we are more willing to help customers grow.
◪ Rapid feedback on the layout,build-up, panels,
impedance, material selection, design rules, manufacturability,
costs of different solutions, use of micro vias, gold plating, special
laminates, etc.
◪ Strong partnerships with different reputed material suppliers such as
Rogers, Arlon, Nelco and Taconic can realize a fast service to a wide
range of PCB applications.
◪ Dozens of tests such as open/short
circuit testing( ET test), AOI, X-ray, impedance testing, solderability
testing, thermal shock testing, metallographic micro-slicing analysis,
halogen-free testing, etc.100% outgoing pass rate.
◪ Complete services from free DFM, traceable manufacturing to complete after-sales service, on time delivery 99%.
◪ We will keep secret for customer sale area,design ideas, drawing and all other private information.
◪ Flexible payment terms. Samples for 100%TT, mass production payment: 50% advance payment 50% balance should be paid off before loading or accept monthly statement if the order is stable.
QUICK LINKS
CONTACT US
Office: (+86) 755 23040566
Tel: (+86) 158 9965 5195
E-mail: sales@rocket-pcb.com
Skype: Hans@Rocket-PCB
Whatsapp: 86 1589965 5195
Office Address: 301 Building/B, Huafeng Digital Technology Industrial Park, Chaoyang Ro, Yanchuan, Songgang,518105 Shenzhen, China.
Plant ADD.: No 69, Lianfeng North Road, Xianxi Area, ChangAn Town, Dongguan, China.
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