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hybrid rf applications material structure for digital product

hybrid rf applications material structure for digital product
  • hybrid rf applications material structure for digital product
  • hybrid rf applications material structure for digital product
  • hybrid rf applications material structure for digital product

hybrid rf applications material structure for digital product

The design of Rocket PCB rf applications is a consequence of many combined parameters. Geometry, materials, surface area design, and air velocity are all seriously considered in enhancing the performance of the product. This product features low noise
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hybrid RF PCB



Because it is a high frequency signal transmission, the characteristic impedance of the finished printed board wire is required to be strict, and the line width of the board usually requires ±0.02mm. Therefore, the etching process needs to be strictly controlled, and the negatives used for optical imaging transfer should be compensated according to the line width and copper foil thickness.
The lines of such printed boards do not transmit current, but high-frequency electrical pulse signals, and defects such as pits, notches and pinholes on the wires affect transmission, and any such minor defects are not allowed. Sometimes, the thickness of the soldermask will also be strictly controlled, too thick or too thin soldermask on the line which a few microns will also be judged unqualified.
Thermal shock 288℃,10 seconds, 1~3 times, no hole wall separation.

For PTFE plate, to solve the wetting in the hole, there is no cavity in the PTH, the copper layer electroplated in the hole to withstand thermal shock, which is one of the difficulties in making the Teflon board


Where is the high frequency Hybrid board used



Satellite receivers, base antennas, microwave transmissions, automotive telephones, global positioning systems, satellite communications, communication equipment connectors, receivers, signal oscillators, home appliances networking, high-speed running computers, oscilloscopes, IC test instruments, etc., high-frequency communications. Frequency communication, high-speed transmission, high confidentiality, high transmission quality, high memory capacity processing and other communications and computer fields need high-frequency microwave printed boards




Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Rocket PCB rf applications is produced in a variety of ways depending on the required performance, and the production procedures mainly include machining, extrusion, forging, stamping, and skiving. Its running brings no dust
During the development of Rocket PCB rf applications, the interface with the device issue is taken into consideration with the purpose of reducing the tiny air gaps between the component and the product. High-efficiency drive is in the product
Much advanced quality inspection equipment is used in Rocket PCB rf applications production. It is finely handled by the coordinate measuring machine (CMM), caliper, microcaliper, gauge, and pass meter. Its quality is ISO9001 assured
Advanced inspection measures are used in the production of Rocket PCB rf applications, such as coordinate measuring machine, gauges, roughness tester, and hardness tester. Its running brings no dust
Rocket PCB rf applications is developed after careful consideration. It is created based on the theory of maximum heat dissipation for devices by our in-house R&D department. This product is engineered for industrial air and air compressing
The application result shows that rf applications is of practical use because it has the characteristics of rf applications. This product is engineered for industrial air and air compressing
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