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hybrid rf applications material structure for digital product

hybrid rf applications material structure for digital product
  • hybrid rf applications material structure for digital product
  • hybrid rf applications material structure for digital product
  • hybrid rf applications material structure for digital product

hybrid rf applications material structure for digital product

Rocket PCB rf applications is upgraded from time to time as per the latest technological innovations.
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hybrid RF PCB



Because it is a high frequency signal transmission, the characteristic impedance of the finished printed board wire is required to be strict, and the line width of the board usually requires ±0.02mm. Therefore, the etching process needs to be strictly controlled, and the negatives used for optical imaging transfer should be compensated according to the line width and copper foil thickness.
The lines of such printed boards do not transmit current, but high-frequency electrical pulse signals, and defects such as pits, notches and pinholes on the wires affect transmission, and any such minor defects are not allowed. Sometimes, the thickness of the soldermask will also be strictly controlled, too thick or too thin soldermask on the line which a few microns will also be judged unqualified.
Thermal shock 288℃,10 seconds, 1~3 times, no hole wall separation.

For PTFE plate, to solve the wetting in the hole, there is no cavity in the PTH, the copper layer electroplated in the hole to withstand thermal shock, which is one of the difficulties in making the Teflon board


Where is the high frequency Hybrid board used



Satellite receivers, base antennas, microwave transmissions, automotive telephones, global positioning systems, satellite communications, communication equipment connectors, receivers, signal oscillators, home appliances networking, high-speed running computers, oscilloscopes, IC test instruments, etc., high-frequency communications. Frequency communication, high-speed transmission, high confidentiality, high transmission quality, high memory capacity processing and other communications and computer fields need high-frequency microwave printed boards




Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Thanks to the low cost of raw materials and the high efficiency of streamlined production, rf applications products have the advantage of high gross profit margin. The product is widely applied in consumer electronics
Rocket PCB rf applications comes in a variety of wonderful designs. Its parts are spaced evenly and traces are symmetric and uniform
High technical assurance and first-class quality can be seen on rf applications. The product reduces the possibility of loose connections or short circuit
All raw materials used to manufactured Rocket PCB rf applications have to go through stringent quality checking procedure. It is hard to find any short circuits in this product
The design of Rocket PCB rf applications focuses on the technique and function. The product allows a high density among components
rf applications has advantages both in cost, reliability and long life, in comparison with other similar products. It is specifically designed to lessen the chances of shorts and wiring issues
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