hot-sale rigid pcb printed circuit for instrumentation

These PCBs integrate flexible PCBs and rigid PCBs. Because the connection between layers does not require connectors, they are ideal for digital devices that are susceptible to noise. In addition, these PCBs can be designed to create thinner devices with no-connector and three dimensions.
Rigid-flex printed circuit boards can help you reduce space and ensure that your products are able to withstand harsh conditions. Also, they are cost-effective.
A rigid-flex format allows you to use fewer interconnecting segments to take on more challenges. So the rigid-flex PCB is a very flexible solution to many design problems. They are suitable for industries ranging from hearing aids to night vision mirrors.

Rocket PCB is an innovative manufacturer focusing on electronic manufacturing. Rocket PCB is dedicated to spending 10 years of efforts advancing itself. We develop, produce and sell numerous successful high-quality products, including rigid, rigid-flex, HDI, any layer, Flex, large-size, embedded, RF, LED, backplane, metal substrate, ceramic substrate, IC structure, high-frequency, heavy copper. High quality and high reliability.

SPECIALIZED MANUFACTURING

• Conductive materials and core-to-core bonding

• Embedded components
  

• RF connector attachment

• Laser direct imaging (LDI)
  

• Laser etching

• Laser forming
  

• Multi-level cavity construction

• Plated cavities and edges

• Composite/hybrid Structures

• N+N dual press-fit

• Dual-drill

• Bonding on metal core

• Bulid-up HDI

• Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

CAPABILITIES

• 3mil line and space

• 4mil laser defined vias

• 6mil chip-on-board

• 6mil mechanically drilled vias

• Conductive and non-conductive via fill

• Dual backdrilling

• Sequential lamination

• Mixed dielectric
  

• Heatsink Bonding

• Heavy copper/thermal vias

• Blind/buried vias

• Stacked and staggerd microvias

  
  

  
  

EXTENSIVE ANALYTICAL TESTING

• Design Rules Check(DRC)

• Electrical Testing

• Automated Optical Inspection(AOI)

• X-Ray

• Plating thickness testing

• Metalized vias inspection

• Thermal shock testing

• Surface peelability testing

• Impedance control testing

• 100% visual inspection

• Solderability testing

• Ionic cleanliness testing

• Metallographic microscopic analysis

• High voltage testing
  

• Insulating resistance testing

FEATURES

• PTFE

• High speed/low loss

• High temperature

• Low CTE

• Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
  

• Combination surface finished

• Copper-filled microvias